发明授权
- 专利标题: Polishing apparatus
- 专利标题(中): 抛光设备
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申请号: US683424申请日: 1996-07-18
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公开(公告)号: US5716264A公开(公告)日: 1998-02-10
- 发明人: Norio Kimura , Ritsuo Kikuta , You Ishii , Masayoshi Hirose
- 申请人: Norio Kimura , Ritsuo Kikuta , You Ishii , Masayoshi Hirose
- 申请人地址: JPX Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX7-203906 19950718
- 主分类号: B24B37/00
- IPC分类号: B24B37/00 ; B24B53/007 ; B24B21/18
摘要:
A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.
公开/授权文献
- US5225463A Self-extinguishing polymeric compositions 公开/授权日:1993-07-06