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发明授权
US5720100A Assembly having a frame embedded in a polymeric encapsulant and method for forming same 失效
具有嵌入聚合物密封剂中的框架的组件及其形成方法

Assembly having a frame embedded in a polymeric encapsulant and method for forming same
摘要：
A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34) and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).
摘要（中）：

微电子组件（10）包括安装到印刷电路板（14）的集成电路管芯（12）。 集成电路管芯（12）覆盖印刷电路板（14），并且包括面向印刷电路板（14）的有效面（26），并通过间隙（30）与其间隔开。 多个焊料凸点互连（32）跨过间隙（30）延伸并且将多个板接合焊盘（22）与多个管芯接合焊盘（28）连接。 聚合物前体（13）围绕集成电路管芯（12）分配到印刷电路板（14）上并且可固化以形成聚合密封剂（16）。 聚合物前体（13）被拉入间隙（30）并形成覆盖印刷电路板（14）的圆角（34）。 将框架（18）嵌入在圆角（34）中，并且加热聚合物前体（13）以固化聚合物前体（13）以形成聚合物密封剂（16）。 框架（18）固定在聚合物密封剂（16）内的印刷电路板（14）上，以为微电子组件（10）提供增加的机械强度。

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