发明授权
- 专利标题： Wire bonding apparatus
- 专利标题（中）： 接线装置
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申请号： US657016申请日： 1996-05-30
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公开(公告)号： US5720424A公开(公告)日： 1998-02-24
- 发明人: Takashi Takeuchi
- 申请人： Takashi Takeuchi
- 申请人地址： JPX Tokyo
- 专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人： Kabushiki Kaisha Shinkawa
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-154048 19950530
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; B23K20/00 ; H01L21/603
摘要：
In a wire bonding apparatus used in manufacturing, for instance, semiconductor devices, a cover is attached to a detection image intake section of the camera mirror tube of a camera which detects the bonding points of a semiconductor workpiece, and the cover covers an area where a variation in air density occurs between the detection image intake section of the camera mirror tube and the semiconductor workpiece.
公开/授权文献
- US5141904A Reactivation of spent cracking catalysts 公开/授权日：1992-08-25
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