发明授权
US5734556A Mechanical heat sink attachment having two pin headers and a spring clip
失效
具有两个针头和弹簧夹的机械散热器附件
- 专利标题： Mechanical heat sink attachment having two pin headers and a spring clip
- 专利标题（中）： 具有两个针头和弹簧夹的机械散热器附件
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申请号： US670663申请日： 1996-06-26
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公开(公告)号： US5734556A公开(公告)日： 1998-03-31
- 发明人: Mohsen Saneinejad , Hassan Siahpolo
- 申请人： Mohsen Saneinejad , Hassan Siahpolo
- 申请人地址： CA Mountain View
- 专利权人： Sun Microsystems, Inc.
- 当前专利权人： Sun Microsystems, Inc.
- 当前专利权人地址： CA Mountain View
- 主分类号： H01L23/40
- IPC分类号： H01L23/40 ; H05K7/20
摘要：
An assembly for clamping a heat sink to an integrated circuit package that is mounted to printed circuit board. The assembly includes a pair of pin headers that are mounted to the printed circuit board. The assembly also contains a clip that is snapped onto the pin headers and presses the heat sink into the package. The pin headers each have a pair of posts that extend from a spacer. The posts are soldered to the printed circuit board to secure the headers to the board. The headers also have wire loops that extend from the spacers and capture the ends of the clip.
公开/授权文献
- US5218759A Method of making a transfer molded semiconductor device 公开/授权日：1993-06-15
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