A vacuum arc deposition apparatus includes arc power sources having cathodes connected to both ends of an evaporation source; exciting coils disposed at positions axially outwardly far from both the ends of the evaporation source so as to be coaxial with the evaporation source; and coil power sources independently connected to the exciting coils. In this apparatus, each of the coil power sources is capable of controlling the exciting current in such a manner that the film thickness and the consumption of the evaporation source are suitably distributed. Moreover, an arc containment device of the vacuum arc deposition apparatus includes an arc containment body having a diameter substantially the same as that of a cylindrical evaporation source, which is disposed at one end portion of the evaporation source.