发明授权
US5748549A Semiconductor memory device 失效
半导体存储器件

Semiconductor memory device
摘要:
A first interconnection frame is provided on a semiconductor substrate so as to surround a central circuit strip. A second interconnection frame is provided on first metal interconnection frame with an insulating film therebetween. Both ends of a supply line are in contact with second interconnection frame. There is a gap provided between both ends of a ground line and second interconnection frame. Ground line and first interconnection frame are connected, using a via hole provided in the insulating film. Thus, an improved dynamic random access memory in which the voltage levels of supply lines and ground lines are stabilized is provided.
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