发明授权
US5776587A Electronic package comprising a substrate and a semiconductor device
bonded thereto
失效
电子封装，包括衬底和与其结合的半导体器件
- 专利标题： Electronic package comprising a substrate and a semiconductor device bonded thereto
- 专利标题（中）： 电子封装，包括衬底和与其结合的半导体器件
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申请号： US928497申请日： 1997-09-12
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公开(公告)号： US5776587A公开(公告)日： 1998-07-07
- 发明人: Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
- 申请人： Marie Angelopoulos , Vlasta A. Brusic , Teresita Ordonez Graham , Sampath Purushothaman , Ravi F. Saraf , Jane Margaret Shaw , Judith Marie Roldan , Alfred Viehbeck
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： C08G61/12
- IPC分类号： C08G61/12 ; C08L33/00 ; C08L65/00 ; C09D5/08 ; C09D5/24 ; C09J9/02 ; H01B1/12 ; H01B1/22 ; H01B1/24 ; H05K3/32 ; H05K9/00 ; B32B9/00 ; H01B1/06
摘要：
A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. The compositions of the present invention are useful as adhesives for interconnecting a semiconductor chip to a substrate.
公开/授权文献
- US5353951A Serviceable storage and transport container 公开/授权日：1994-10-11
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