There is disclosed a process for preserving solder paste which comprises housing solder paste in a vessel which is substantially free from oxygen and moisture and is imparted with gas barrier properties. The process is preferably carried out by housing the solder paste together with an oxygen absorbent not requiring moisture for absorbing oxygen (e.g. unsaturated fatty acid compound and chain hydrocarbon polymer having unsaturated groups) and optionally a dehumidifying agent and/or an acidic gas absorbent in the above vessel and subsequently hermetically sealing said vessel. The process makes it possible to prevent the deterioration of the solder paste such as viscosity change of the solder and the formation of solder balls which affect the printability and solder reflowability, to preserve the solder paste at room temperature and to remarkably prolong its service term.