利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US5780576A Thermoplastic molding materials based on partly aromatic poly-amides and polyetherimides 失效
基于部分芳族聚酰胺和聚醚酰亚胺的热塑性成型材料

Thermoplastic molding materials based on partly aromatic poly-amides and polyetherimides
摘要：
Thermoplastic molding materials contain A) from 1 to 99% by weight of a partly aromatic copolyamide composed of a.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid, a.sub.2) from 6 to 25 mol % of units which are derived from isophthalic acid, a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine and a.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms, the molar percentages of components a.sub.1) to a.sub.4) together giving 100%, B) from 1 to 99% by weight of a polyetherimide, C) from 0 to 30% by weight of a polymeric component having OH groups, D) from 0 to 60% by weight of fibrous or particulate fillers or mixtures thereof, E) from 0 to 40% by weight of rubber impact modifiers and F) from 0 to 40% by weight of conventional additives and processing assistants.
摘要（中）：

热塑性成型材料包含A）1至99重量％的部分芳族共聚酰胺，其由a1- 30-44摩尔％的衍生自对苯二甲酸的单元组成，a2）6至25摩尔％衍生的单元 来自间苯二甲酸，a3）43〜49.5摩尔％的衍生自六亚甲基二胺的单元和a4）0.5〜7摩尔％的衍生自6〜30个碳原子的脂肪族环状二胺的单元，成分a1 ）与a4）一起提供100％的B）1至99重量％的聚醚酰亚胺，C）0至30重量％的具有OH基团的聚合物组分，D）0至60重量％的纤维 或颗粒填料或其混合物，E）0至40重量％的橡胶抗冲改性剂和F）0至40重量％的常规添加剂和加工助剂。

公开/授权文献
信息查询
Global Dossier Espacenet
0/0