发明授权
- 专利标题： Semiconductor device and method of producing said semiconductor device
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US795185申请日： 1997-02-04
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公开(公告)号： US5783463A公开(公告)日： 1998-07-21
- 发明人: Shinitsu Takehashi , Kenzo Hatada
- 申请人： Shinitsu Takehashi , Kenzo Hatada
- 申请人地址： JPX Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX Osaka
- 优先权： JPX6-077112 19940415
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/603 ; H01L23/495 ; H01L21/60
摘要：
The present invention is premised on a semiconductor device in which one semiconductor chip is mounted on each of both faces of a die pad of a lead frame. The semiconductor chips are disposed such that the projected lines, on the die pad, of the corresponding sides of the semiconductor chips, intersect with each other at an angle of 45.degree.. The tips of inner leads are located in the sides of a virtual octagon formed by outwardly enlarging an octagon formed by connecting, to one another, the apexes of the semiconductor chips. The sides of the virtual octagon are respectively opposite to the sides of the semiconductor chips. The number of the inner leads of which tips are located in each of the sides of the virtual octagon, is the same as the number of bonding pads disposed at each of the sides of the semiconductor chips. The inner leads of which tips are located in each of the sides of the virtual octagon, are connected to the bonding pads at each of the sides of one of the first and second semiconductor chips.
公开/授权文献
- US5260142A Corrosion-resistant clad material made of aluminum alloys 公开/授权日：1993-11-09
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