Invention Grant
- Patent Title: Wiring board for supporting an array of imaging chips
- Patent Title (中): 用于支持一系列成像芯片的接线板
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Application No.: US840210Application Date: 1997-04-11
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Publication No.: US5784258APublication Date: 1998-07-21
- Inventor: Kraig A. Quinn
- Applicant: Kraig A. Quinn
- Applicant Address: CT Stamford
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: CT Stamford
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L21/60 ; H01L23/12 ; H05K1/14 ; H05K3/28 ; H05K3/30 ; H05K3/32 ; H05K13/00
Abstract:
A printed wiring board includes features which allow the board to be held firmly in place by a vacuum mounting device so that semiconductor chips can be placed thereon, and wire bonds established between the semiconductor chips and the circuitry on the board. The side of the board opposite the side having the semiconductor chips defines a ridge which encloses a portion of the surface area thereof. The ridge forms a gasket around a vacuum slot on the vacuum mounting device. The ridge also provides a firm surface for wirebonds to be ultrasonically welded to landings on the board.
Public/Granted literature
- US4204168A Signal converter using a quad diode race Public/Granted day:1980-05-20
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