An apparatus and method for support and alignment of electronic modules. Electronic modules have V-shaped grooves in their top and bottom surfaces. A rack assembly includes an upper frame and a lower frame, each having a plurality of parallel guide members attached to a support member. The upper and lower frames are advantageously constructed as mirror images of each other. The guide members are adapted to be received in the grooves in the electronic modules, the guide members of the upper frame receiving the grooves in the top surfaces of the modules and the guide members of the lower frame receiving the grooves in the bottom surfaces of the modules. A module is installed in the assembly by aligning the grooves in the module with the corresponding guide members of the frames and pushing the module into the rack assembly. As the module moves into the assembly, the guide members are received in the grooves of the module thereby supporting the module and aligning electrical connectors on the module with electrical connectors on a backplane or other unit.