发明授权
- 专利标题: Encapsulation method
- 专利标题(中): 封装方法
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申请号: US609786申请日: 1996-03-04
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公开(公告)号: US5798070A公开(公告)日: 1998-08-25
- 发明人: Kunito Sakai , Kazuharu Oshio , Hirozoh Kanegae
- 申请人: Kunito Sakai , Kazuharu Oshio , Hirozoh Kanegae
- 申请人地址: JPX Tokyo
- 专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人: Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX5-33308 19930223
- 主分类号: B29C45/14
- IPC分类号: B29C45/14 ; B29C45/26 ; H01L21/00 ; H01L21/56 ; B29C33/24 ; B29C70/70
摘要:
A molding machine comprises a mold composed of lower and upper mold sections. A recess is defined in the lower mold section to receive a lead frame or other objects. The lead frame is sandwiched between the upper and lower mold sections. A mold cavity is defined in the lower mold section below the recess so as to receive a thermosetting resin or encapsulant. A gasket groove is defined adjacent to the mold cavity to receive a gasket. The gasket is subject to plastic deformation upon application of force. An oil chamber is communicated with the gasket groove and contains hydraulic oil. The hydraulic oil is pressurized to urge the gasket against the lead frame. As a result, the gasket is so deformed as to closely contact the surface of the lead frame and seal the mold cavity. The hydraulic oil is preferably mixed with thermoplastic resin in powder form.
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