公开(公告)号：US5597523A

公开(公告)日：1997-01-28

申请号：US292269

申请日：1994-08-18

申请人： Kunito Sakai ,  Kazuharu Oshio ,  Hirozoh Kanegae

发明人： Kunito Sakai ,  Kazuharu Oshio ,  Hirozoh Kanegae

IPC分类号： B29C45/26 ,  B29C45/02 ,  B29C45/14

CPC分类号： H02K15/12 ,  B29C45/2608

摘要： A molding apparatus having an upper mold, a lower mold, and a cylindrical mold cavity defined between the upper mold and the lower mold and adapted to receive a molding material such as epoxy resin. An annular recess is defined in the lower mold adjacent to the mold cavity. A gasket is fit in the recess and made of lead. An oil passage is defined in the lower mold. Silicon oil as a pressure medium is fed to the recess through the oil passage so as to press the gasket against the upper mold. Then, the gasket is deformed to form a seal around a portion of the mold cavity where the upper and lower molds mate with one another. An annular spacer is placed in the bottom of the recess. An annular groove is defined below and along the bottom of the recess so as to allow the silicon oil to flow below and along the annular spacer, whereby sufficient pressure is exerted uniformly on the gasket to cause deformation of the gasket.

摘要翻译： 一种具有上模具，下模具和限定在上模具和下模具之间并适于容纳诸如环氧树脂的模制材料的圆柱形模腔的模制设备。 在下模中限定了与模腔相邻的环形凹部。 凹槽内装有垫圈，由铅制成。 油通道限定在下模具中。 作为压力介质的硅油通过油路供给到凹部，以将垫圈压靠在上模上。 然后，垫圈变形以在模具腔的一部分周围形成密封，其中上模和下模相互配合。 环形间隔件放置在凹槽的底部。 在凹槽的下方并沿着凹部的底部限定环形槽，以便允许硅油沿着环形间隔件流动并沿着环形间隔件流动，从而在垫圈上均匀地施加足够的压力以引起垫圈的变形。

公开(公告)号：US5395226A

公开(公告)日：1995-03-07

申请号：US130444

申请日：1993-10-01

申请人： Kunito Sakai ,  Kazuharu Oshio ,  Hirozoh Kanegae

发明人： Kunito Sakai ,  Kazuharu Oshio ,  Hirozoh Kanegae

IPC分类号： B29C45/14 ,  B29C45/26 ,  H01L21/00 ,  H01L21/56 ,  B29C45/02

CPC分类号： B29C45/14336 ,  B29C45/14418 ,  B29C45/14655 ,  B29C45/2608 ,  H01L21/565 ,  H01L2224/48247 ,  Y10S264/50 ,  Y10S425/019 ,  Y10S425/047 ,  Y10S425/228

摘要： A molding machine includes a mold composed of lower and upper mold sections. A recess is defined in the lower mold section to receive a lead frame or other objects. The lead frame is sandwiched between the upper and lower mold sections. A mold cavity is defined in the lower mold section below the recess so as to receive a thermosetting resin or encapsulant. A gasket groove is defined adjacent to the mold cavity to receive a gasket. The gasket is subject to plastic deformation upon application of force. An oil chamber is communicated with the gasket groove and contains hydraulic oil. The hydraulic oil is pressurized to urge the gasket against the lead frame. As a result, the gasket is so deformed as to closely contact the surface of the lead frame and seal the mold cavity. The hydraulic oil is preferably mixed with thermoplastic resin in powder form.

摘要翻译： 成型机包括由下模和上模组成的模具。 在下模具部分中限定凹部以接收引线框架或其它物体。 引线框架夹在上下模具部分之间。 在凹部下方的下模具部分中限定模腔，以便容纳热固性树脂或密封剂。 垫圈槽限定在模腔附近以接收垫圈。 施加力时，垫片会发生塑性变形。 油室与垫圈槽连通并含有液压油。 液压油被加压以将垫片推向引线框架。 结果，垫圈被如此变形以紧密地接触引线框架的表面并密封模腔。 液压油优选与粉末状的热塑性树脂混合。

公开(公告)号：US5082615A

公开(公告)日：1992-01-21

申请号：US404389

申请日：1989-09-08

申请人： Kunito Sakai

发明人： Kunito Sakai

IPC分类号： B29C45/02 ,  B29C45/34 ,  B29C45/46 ,  H01L21/00 ,  H01L21/56

CPC分类号： B29C45/34 ,  B29C45/02 ,  B29C45/462 ,  H01L21/565 ,  H01L2924/0002

摘要： A method for packaging semiconductor devices in resin uses a mold having a pot and cavities, a vacuum pump for drawing off the air contained in the pot and the gases emitted from a resin tablet placed in the pot, and a pressing piston for pressing the resin tablet to feed the resin to the cavities. The pot has a volume which is greater than the maximum volume to which the heated resin tablet expands in a vacuum. The method includes the steps of placing the resin tablet in the pot, heating the resin under an applied vacuum until it expands to a sufficient extent to draw away gas trapped in the heated resin tablet, pressing the heated resin to the cavities to surround semiconductor devices placed therein, and curing the resin.

摘要翻译： 在树脂中包装半导体器件的方法使用具有罐和腔的模具，用于抽出罐中所含的空气的真空泵和从放置在罐中的树脂片排出的气体，以及用于挤压树脂的按压活塞 片剂将树脂喂入空腔。 该罐的体积大于加热的树脂片在真空中膨胀的最大体积。 该方法包括以下步骤：将树脂片放置在锅中，在施加的真空下加热树脂，直到其膨胀到足够的程度以抽出被捕获在加热的树脂片中的气体，将加热的树脂压到空腔中以围绕半导体器件 并固化树脂。

公开(公告)号：US4963307A

公开(公告)日：1990-10-16

申请号：US271905

申请日：1988-11-16

申请人： Kunito Sakai ,  Sueyosi Tanaka ,  Yasutugu Tutumi ,  Yutaka Morita

发明人： Kunito Sakai ,  Sueyosi Tanaka ,  Yasutugu Tutumi ,  Yutaka Morita

IPC分类号： B29B11/12 ,  B29B11/14 ,  B29C37/00 ,  B29C43/00 ,  B29C43/56

CPC分类号： B29B11/14 ,  B29B11/12 ,  B29C37/006 ,  B29C43/006 ,  B29C43/56 ,  Y10T428/8305

摘要： A resin-molding tablet for use in resin-molding semiconductor devices has a tablet body formed of powdered or particulate resin. The particles of the resin are compacted such as to form voids between adjacent particles. At least the outer peripheral region of the tablet is fused such that the resin particles are welded together to form a continuous layer of fine and impervious structure substantially free of open pores. The internal air trapped in the voids of the tablet is drawn and removed before the tablet is fused so that the tablet is substantially free of air. The tablet is produced by placing a particulate or powdered resin material in a vacuum vessel so as to allow the internal air in the resin material to be drawn outside, and then applying pressure and heat to the resin material so that at least the peripheral region of the mass of the particulate resin is fused to weld together. The tablet thus formed is melted and forcibly fed into a vacuum die cavity in which a semiconductor device to be molded is accommodated, thereby to hermetically seal the semiconductor device. Thus, a semiconductor package having substantially no voids is produced.

摘要翻译： 用于树脂模制半导体器件的树脂模制片具有由粉末状或颗粒状树脂形成的片状体。 树脂的颗粒被压实，以便在相邻的颗粒之间形成空隙。 至少片剂的外周区域被熔合，使得树脂颗粒被焊接在一起以形成基本上没有开放孔隙的细小且不可渗透的结构的连续层。 在片剂融合之前，将片剂空隙内捕集的内部空气抽吸除去，使得片剂基本上不含空气。 通过将颗粒状或粉末状的树脂材料放置在真空容器中，使树脂材料中的内部空气向外部拉出，然后向树脂材料施加压力和热量，从而至少将 将颗粒状树脂的质量熔合以一起焊接。 将如此形成的片剂熔化并强制地进料到其中容纳待模制的半导体器件的真空模腔中，从而气密地密封半导体器件。 因此，产生基本上没有空隙的半导体封装。

公开(公告)号：US4826931A

公开(公告)日：1989-05-02

申请号：US107336

申请日：1987-10-09

申请人： Kunito Sakai ,  Sueyosi Tanaka ,  Yasutugu Tutumi ,  Yutaka Morita

发明人： Kunito Sakai ,  Sueyosi Tanaka ,  Yasutugu Tutumi ,  Yutaka Morita

IPC分类号： B29B11/12 ,  B29B11/14 ,  B29C37/00 ,  B29C43/00 ,  B29C43/56 ,  C08G59/02 ,  C08J5/00

CPC分类号： B29B11/14 ,  B29B11/12 ,  B29C37/006 ,  B29C43/006 ,  B29C43/56 ,  Y10T428/8305

摘要： A resin-molding tablet for use in resin-molding semiconductor devices has a tablet body formed of powdered or particulate resin. The particles of the resin are compacted such as to form voids between adjacent particles. At least the outer peripheral region of the tablet is fused such that the resin particles are welded together to form a continuous layer of fine and impervious structure substantially free of open pores. The internal air trapped in the voids of the tablet is drawn and removed before the tablet is fused so that the tablet is substantially free of air. The tablet is produced by placing a particulate or powdered resin material in a vacuum vessel so as to allow the internal air in the resin material to be drawn outside, and then applying pressure and heat to the resin material so that at least the peripheral region of the mass of the particulate resin is fused to weld together. The tablet thus formed is melted and forcibly fed into a vacuum die cavity in which a semiconductor device to be molded is accommodated, thereby to hermetically seal the semiconductor device. Thus, a semiconductor package having substantially no voids is produced.

摘要翻译： 用于树脂模制半导体器件的树脂模制片具有由粉末状或颗粒状树脂形成的片状体。 树脂的颗粒被压实，以便在相邻的颗粒之间形成空隙。 至少片剂的外周区域被熔合，使得树脂颗粒被焊接在一起以形成基本上没有开放孔隙的细小且不可渗透的结构的连续层。 在片剂融合之前，将片剂空隙内捕集的内部空气抽吸除去，使得片剂基本上不含空气。 通过将颗粒状或粉末状的树脂材料放置在真空容器中，使树脂材料中的内部空气向外部拉出，然后向树脂材料施加压力和热量，从而至少将 将颗粒状树脂的质量熔合以一起焊接。 将如此形成的片剂熔化并强制地进料到其中容纳待模制的半导体器件的真空模腔中，从而气密地密封半导体器件。 因此，产生基本上没有空隙的半导体封装。

公开(公告)号：US4717948A

公开(公告)日：1988-01-05

申请号：US576882

申请日：1984-02-03

申请人： Kunito Sakai ,  Akinobu Tamaki ,  Takashi Takahama

发明人： Kunito Sakai ,  Akinobu Tamaki ,  Takashi Takahama

IPC分类号： H01L23/06 ,  H01L21/56 ,  H01L23/02 ,  H01L23/057 ,  H01L23/08 ,  H01L23/14 ,  H01L23/20 ,  H01L23/26 ,  H01L23/29 ,  H01L23/31 ,  H01L23/12

CPC分类号： H01L21/565 ,  H01L23/057 ,  H01L23/08 ,  H01L23/145 ,  H01L23/20 ,  H01L23/26 ,  H01L23/293 ,  H01L23/315 ,  H01L24/97 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/0101 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025

摘要： A semiconductor device includes an electronic component in a hollow portion provided between two packing members each comprising a laminated structure. A laminated structure has a metallic layer and an insulating layer. The laminated structure can further have a reinforcing layer. One end surface of the laminated structure is an insulating layer. The insulating layers of these laminated structures oppose each other with peripheral portions thereof hermetically connected, so that the hollow portion containing the electronic component is airtight. A metallic layer is formed of a metal such as aluminum or an alloy thereof, an insulating layer is formed of organic material and the like and a reinforcing layer is formed of a fiber, a thermosetting resin, a thermoplastic resin and the like. The electronic component contained in the hollow portion is positioned to avoid contact with the packing members. The electronic component is electrically connected to the exterior through lead wires interposed between the contact surfaces of the two packing members.

摘要翻译： 半导体器件包括设置在两个包括层压结构的包装构件之间的中空部分中的电子部件。 叠层结构具有金属层和绝缘层。 层压结构还可以具有加强层。 层叠结构的一个端面是绝缘层。 这些层叠结构体的绝缘层与其周边部分密封地相互对置，使得包含电子部件的中空部分是气密的。 金属层由铝或其合金等金属形成，绝缘层由有机材料等形成，增强层由纤维，热固性树脂，热塑性树脂等形成。 包含在中空部分中的电子部件被定位成避免与包装件接触。 电子部件通过设置在两个包装部件的接触面之间的引线电连接到外部。

公开(公告)号：US4697203A

公开(公告)日：1987-09-29

申请号：US741051

申请日：1985-06-04

申请人： Kunito Sakai ,  Sadamu Matsuda ,  Takashi Takahama

发明人： Kunito Sakai ,  Sadamu Matsuda ,  Takashi Takahama

IPC分类号： H01L23/02 ,  G11C16/18 ,  H01L23/10 ,  H01L23/06 ,  H01L23/30

CPC分类号： G11C16/18 ,  H01L23/10 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49121 ,  Y10T29/53196

摘要： A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die pad of a lead frame. A softened resin is then extruded from the opposite surface of the die pad through gaps between the die pad and the leads with the extrusion being carried out in an inert gas atmosphere. An inner package member is thus formed surrounding the semiconductor chip. An outer package member, made of a thermosetting resin having a weight ratio of resin to filler less than that of the inner package, is molded around the chip assembly and inner package.

摘要翻译： 一种半导体器件和制造半导体器件的方法，所述半导体器件具有树脂封装和诸如石英玻璃窗等紫外线透明的封装中的窗口。 将半导体芯片接合到引线框架的管芯焊盘的表面上。 然后，通过挤出在惰性气体气氛中进行，从芯片垫和引线之间的间隙将软化的树脂从模片垫的相对表面挤出。 因此，围绕半导体芯片形成内包装件。 在芯片组件和内部封装件周围形成由热固性树脂制成的外包装件，其具有树脂与填料的重量比小于内包装的重量比。

公开(公告)号：US5798070A

公开(公告)日：1998-08-25

申请号：US609786

申请日：1996-03-04

申请人： Kunito Sakai ,  Kazuharu Oshio ,  Hirozoh Kanegae

发明人： Kunito Sakai ,  Kazuharu Oshio ,  Hirozoh Kanegae

IPC分类号： B29C45/14 ,  B29C45/26 ,  H01L21/00 ,  H01L21/56 ,  B29C33/24 ,  B29C70/70

CPC分类号： B29C45/14336 ,  B29C45/14418 ,  B29C45/14655 ,  B29C45/2608 ,  H01L21/565 ,  H01L2224/48247 ,  Y10S264/50 ,  Y10S425/019 ,  Y10S425/047 ,  Y10S425/228

摘要： A molding machine comprises a mold composed of lower and upper mold sections. A recess is defined in the lower mold section to receive a lead frame or other objects. The lead frame is sandwiched between the upper and lower mold sections. A mold cavity is defined in the lower mold section below the recess so as to receive a thermosetting resin or encapsulant. A gasket groove is defined adjacent to the mold cavity to receive a gasket. The gasket is subject to plastic deformation upon application of force. An oil chamber is communicated with the gasket groove and contains hydraulic oil. The hydraulic oil is pressurized to urge the gasket against the lead frame. As a result, the gasket is so deformed as to closely contact the surface of the lead frame and seal the mold cavity. The hydraulic oil is preferably mixed with thermoplastic resin in powder form.

摘要翻译： 成型机包括由下模和上模组成的模具。 在下模具部分中限定凹部以接收引线框架或其它物体。 引线框架夹在上下模具部分之间。 在凹部下方的下模具部分中限定模腔，以便容纳热固性树脂或密封剂。 垫圈槽限定在模腔附近以接收垫圈。 施加力时，垫片会发生塑性变形。 油室与垫圈槽连通并含有液压油。 液压油被加压以将垫片推向引线框架。 结果，垫圈被如此变形以紧密地接触引线框架的表面并密封模腔。 液压油优选与粉末状的热塑性树脂混合。

公开(公告)号：US4812420A

公开(公告)日：1989-03-14

申请号：US102610

申请日：1987-09-30

申请人： Sadamu Matsuda ,  Kunito Sakai ,  Takashi Takahama

发明人： Sadamu Matsuda ,  Kunito Sakai ,  Takashi Takahama

IPC分类号： H01L31/0203 ,  H01L21/56

CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49158

摘要： A method of producing a semiconductor device having a light transparent window, includes: a process of die bonding a chip onto a lead frame; a process of attaching a wall surrounding a picture element to either of the external contour surface of the surface of the chip or the light transparent window surrounding the picture element; a process of inserting the chip and the light transparent window into a metal mold in such a manner that an empty closed space is produced between the chip and the light transparent window via the wall; and a process of plastic molding the device except for the light transparent window by filling resin into the metal mold and making the resin hardened.

摘要翻译： 一种制造具有透光窗的半导体器件的方法，包括：将芯片芯片接合到引线框架上的工艺; 将围绕图像元素的壁附接到芯片的表面的外部轮廓表面或围绕图像元素的透光窗口的过程; 将芯片和光透明窗口插入金属模具中的方式，使得通过壁在芯片和透光窗之间产生空的封闭空间; 以及通过将树脂填充到金属模具中并使树脂硬化来塑造除了透光窗口之外的装置的工艺。

公开(公告)号：US4769344A

公开(公告)日：1988-09-06

申请号：US62644

申请日：1987-06-16

申请人： Kunito Sakai ,  Sadamu Matsuda ,  Takashi Takahama

发明人： Kunito Sakai ,  Sadamu Matsuda ,  Takashi Takahama

IPC分类号： H01L23/02 ,  G11C16/18 ,  H01L23/10 ,  H01L23/08

CPC分类号： G11C16/18 ,  H01L23/10 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49121 ,  Y10T29/53196

摘要： A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die pad of a lead frame. A softened resin is then extruded from the opposite surface of the die pad through gaps between the die pad and the leads with the extrusion being carried out in an inert gas atmosphere. An inner package member is thus formed surrounding the semiconductor chip. An outer package member, made of a thermosetting resin having a weight ratio of resin to filler less than that of the inner package, is molded around the chip assembly and inner package.

摘要翻译： 一种半导体器件和制造半导体器件的方法，所述半导体器件具有树脂封装和诸如石英玻璃窗等紫外线透明的封装中的窗口。 将半导体芯片接合到引线框架的管芯焊盘的表面上。 然后，通过挤出在惰性气体气氛中进行，从芯片垫和引线之间的间隙将软化的树脂从模片垫的相对表面挤出。 因此，围绕半导体芯片形成内包装件。 在芯片组件和内部封装件周围形成由热固性树脂制成的外包装件，其具有树脂与填料的重量比小于内包装的重量比。