发明授权
- 专利标题: Apparatus for full wafer deposition
- 专利标题(中): 全晶圆沉积装置
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申请号: US567601申请日: 1995-12-05
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公开(公告)号: US5803977A公开(公告)日: 1998-09-08
- 发明人: Avi Tepman , Robert E. Davenport
- 申请人: Avi Tepman , Robert E. Davenport
- 申请人地址: CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: CA Santa Clara
- 主分类号: B65G49/07
- IPC分类号: B65G49/07 ; C23C14/50 ; C23C14/56 ; C23C16/44 ; C23C16/458 ; H01L21/203 ; H01L21/205 ; H01L21/265 ; H01L21/31 ; H01L21/683 ; C23C16/00
摘要:
A readily removable deposition shield assembly for processing chambers such as chemical vapor deposition (CVD), ion implantation, or physical vapor deposition (PVD) or sputtering chambers, is disclosed. The shield assembly includes a shield member which is mounted to the chamber for easy removal, such as by screws, and defines a space along the periphery of the substrate support. A shield ring is inserted into the peripheral space and is thus mounted in removable fashion and is automatically centered about the substrate. The shield ring overlaps the cylindrical shield and a deposition ring. The deposition ring removably rests upon a flange extending from the outer periphery of a substrate support pedestal. Collectively, these components prevent deposition on the chamber and hardware outside the processing region.
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