发明授权
- 专利标题： Semiconductor device and method for producing a semiconductor device
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US839796申请日： 1997-04-18
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公开(公告)号： US5804469A公开(公告)日： 1998-09-08
- 发明人: Yuichi Asano , Hitoshi Kobayashi , Katsunori Wako
- 申请人： Yuichi Asano , Hitoshi Kobayashi , Katsunori Wako
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX8-298605 19961111
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L23/433 ; H01L23/495 ; H01L21/44
摘要：
A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the flat-plate member is attached to plurality of support bars; b) an element mounting process in which a semiconductor element is mounted on the flat-plate member attached to the plurality of support bars of the flat-shape lead frame; c) a wire-bonding process in which a wire is provided between each of the plurality of leads and the semiconductor element; and d) a separating process, performed after the completion of the wire-bonding process, in which the plurality of support bars are deformed so as to separate the flat-plate member and the plurality of leads and electrically disconnect or separate the flat-plate member from the plurality of leads.