公开(公告)号：US07122402B2

公开(公告)日：2006-10-17

申请号：US10781794

申请日：2004-02-20

申请人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

发明人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.

摘要翻译： 在制造本发明的半导体器件的方法中，在树脂封装时，在衬底的表面上支撑一个或多个半导体元件并被夹持在封装模具的上模具和下模具之间的刚性衬底是 使得与封装模具的通气端相对应的衬底的通气端边缘部分的厚度小于衬底的其它部分的厚度。 将基板设置在封装模具中，并将树脂注入到上模和基板之间的空腔中，以用树脂封装半导体元件。

公开(公告)号：US20050070051A1

公开(公告)日：2005-03-31

申请号：US10781794

申请日：2004-02-20

申请人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

发明人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

IPC分类号： H01L21/56 ,  H01L21/48 ,  H01L21/00 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.

摘要翻译： 在制造本发明的半导体器件的方法中，在树脂封装时，在衬底的表面上支撑一个或多个半导体元件并被夹持在封装模具的上模具和下模具之间的刚性衬底是 使得与封装模具的通气端相对应的衬底的通气端边缘部分的厚度小于衬底的其它部分的厚度。 将基板设置在封装模具中，并将树脂注入到上模和基板之间的空腔中，以用树脂封装半导体元件。

公开(公告)号：US5804469A

公开(公告)日：1998-09-08

申请号：US839796

申请日：1997-04-18

申请人： Yuichi Asano ,  Hitoshi Kobayashi ,  Katsunori Wako

发明人： Yuichi Asano ,  Hitoshi Kobayashi ,  Katsunori Wako

IPC分类号： H01L23/50 ,  H01L23/433 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L23/4334 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181

摘要： A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the flat-plate member is attached to plurality of support bars; b) an element mounting process in which a semiconductor element is mounted on the flat-plate member attached to the plurality of support bars of the flat-shape lead frame; c) a wire-bonding process in which a wire is provided between each of the plurality of leads and the semiconductor element; and d) a separating process, performed after the completion of the wire-bonding process, in which the plurality of support bars are deformed so as to separate the flat-plate member and the plurality of leads and electrically disconnect or separate the flat-plate member from the plurality of leads.

摘要翻译： 一种半导体器件的制造方法，其特征在于，包括：a）平板部件位于设置有多个引线和多个支撑杆的扁平状引线框架上的安装工序，使得所述平板部件接触 至少所述多个引线，并且所述平板构件附接到多个支撑杆; b）元件安装工艺，其中将半导体元件安装在平板形元件上，该平板元件安装在平板形引线框架的多个支撑杆上; c）引线接合工艺，其中在所述多个引线和所述半导体元件中的每一个之间设置导线; 以及d）分离处理，其在所述引线接合工艺完成之后进行，其中所述多个支撑杆变形，以便使所述平板部件和所述多个引线分离，并且将所述平板 来自多个线索的成员。

公开(公告)号：US06222258B1

公开(公告)日：2001-04-24

申请号：US09102005

申请日：1998-06-22

申请人： Yuichi Asano ,  Hitoshi Kobayashi ,  Katsunori Wako

发明人： Yuichi Asano ,  Hitoshi Kobayashi ,  Katsunori Wako

IPC分类号： H01L23495

CPC分类号： H01L23/4334 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012

摘要： A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the flat-plate member is attached to plurality of support bars; b) an element mounting process in which a semiconductor element is mounted on the flat-plate member attached to the plurality of support bars of the flat-shape lead frame; c) a wire-bonding process in which a wire is provided between each of the plurality of leads and the semiconductor element; and d) a separating process, performed after the completion of the wire-bonding process, in which the plurality of support bars are deformed so as to separate the flat-plate member and the plurality of leads and electrically disconnect or separate the flat-plate member from the plurality of leads.

摘要翻译： 一种半导体器件的制造方法，其特征在于，包括：a）平板部件位于设置有多个引线和多个支撑杆的扁平状引线框架上的安装工序，使得所述平板部件接触 至少所述多个引线，并且所述平板构件附接到多个支撑杆; b）元件安装工艺，其中将半导体元件安装在平板形元件上，该平板元件安装在平板形引线框架的多个支撑杆上; c）引线接合工艺，其中在所述多个引线和所述半导体元件中的每一个之间设置导线; 以及d）分离处理，其在所述引线接合工艺完成之后进行，其中所述多个支撑杆变形，以便分离所述平板部件和所述多个引线，并且将所述平板 来自多个线索的成员。

公开(公告)号：US07781259B2

公开(公告)日：2010-08-24

申请号：US11516584

申请日：2006-09-07

申请人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

发明人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.

摘要翻译： 在制造本发明的半导体器件的方法中，在树脂封装时，在衬底的表面上支撑一个或多个半导体元件并被夹持在封装模具的上模具和下模具之间的刚性衬底是 使得与封装模具的通气端相对应的基板的通气端边缘部分的厚度小于基板的其它部分的厚度。 将基板设置在封装模具中，并将树脂注入到上模和基板之间的空腔中，以用树脂封装半导体元件。

公开(公告)号：US20070010046A1

公开(公告)日：2007-01-11

申请号：US11516584

申请日：2006-09-07

申请人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

发明人： Youhei Nagahama ,  Katsunori Wako ,  Yuichi Asano ,  Masanori Takahashi ,  Haruo Kojima ,  Masamichi Fujimoto ,  Hiroshi Ohtsubo ,  Yuki Yasuda

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, so that a vent-end edge portion of the substrate corresponding to a vent end of the encapsulation mold has a thickness smaller than a thickness of other portions of the substrate. The substrate is disposed in the encapsulation mold, and resin is injected into a cavity between the upper mold and the substrate to encapsulate the semiconductor elements with the resin.

摘要翻译： 在制造本发明的半导体器件的方法中，在树脂封装时，在衬底的表面上支撑一个或多个半导体元件并被夹持在封装模具的上模具和下模具之间的刚性衬底是 使得与封装模具的通气端相对应的衬底的通气端边缘部分的厚度小于衬底的其它部分的厚度。 将基板设置在封装模具中，并将树脂注入到上模和基板之间的空腔中，以用树脂封装半导体元件。