- 专利标题： Substrate carrier having a streamlined shape and method for thin film formation
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申请号： US799871申请日： 1997-02-14
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公开(公告)号： US5814561A公开(公告)日： 1998-09-29
- 发明人: Paul D. Jackson
- 申请人： Paul D. Jackson
- 专利权人： Jackson; Paul D.
- 当前专利权人： Jackson; Paul D.
- 主分类号： H01L21/687
- IPC分类号： H01L21/687 ; H01L21/44
摘要：
A structure for chemical vapor deposition processing includes a substrate carrier (10) having a streamlined shape. When placed in a mainstream flow (21), the substrate carrier (10) maintains a laminar boundary layer over a substrate (17) under high gas flow rate conditions. In a further embodiment, the substrate carrier (10) includes a device (27) for directly injecting a reactant gas stream (33) into the boundary layer.
公开/授权文献
- US4751785A Resilient retaining coil for excavator tooth 公开/授权日：1988-06-21
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