发明授权
- 专利标题： Boat for heat treatment
- 专利标题（中）： 船热处理
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申请号： US715241申请日： 1996-09-18
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公开(公告)号： US5820367A公开(公告)日： 1998-10-13
- 发明人: Tetsu Osawa
- 申请人： Tetsu Osawa
- 申请人地址： JPX Tokyo-to
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JPX Tokyo-to
- 优先权： JPX7-266531 19950920
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; C30B25/12 ; C30B31/14 ; H01L21/22 ; H01L21/31 ; H01L21/324 ; H01L21/673 ; F27D5/00
摘要：
Support members are provided in a vertically spaced relation on a plurality of upright columns. A wafer support member comprises a projection formed to be annular along an inner peripheral edge of a ring and an outer wall formed along an outer peripheral edge thereof. The wafer is positively supported at a position inwardly of the outer peripheral edge thereof by the projection of the wafer support member despite the presence or absence of a warp thereof. Therefore, a load caused by the weight of the wafer is dispersed over the entire projection of the wafer support member. This suppresses the concentration of stress on a specific portion of the wafer support portion, and a surface defect called a slip generated when the wafer is heat treated can be eliminated.
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