发明授权
- 专利标题： Device for turning a wafer during a wet etching process
- 专利标题（中）： 用于在湿蚀刻工艺期间转动晶片的装置
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申请号： US773059申请日： 1996-12-24
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公开(公告)号： US5827396A公开(公告)日： 1998-10-27
- 发明人: Se-jong Ko , Pyeong-sik Jeon , Young-hwan Yun , Sang-young Moon
- 申请人： Se-jong Ko , Pyeong-sik Jeon , Young-hwan Yun , Sang-young Moon
- 申请人地址： KRX Suwon
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KRX Suwon
- 优先权： KRX1995-59501 19951227
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; H01L21/00 ; H01L21/306 ; C23F1/00 ; C03C25/06
摘要：
A wet etching device used in manufacturing a semiconductor device includes a power source, a transmission device for transmitting power from the power source, and a roller for reversing top and bottom positions of a wafer placed in a processing bath using power from the power source transmitted by the transmission device. Here, the initial top and bottom positions of the wafer during loading are reversed before unloading. Accordingly, the entire surface of the wafer spends an equal amount of time in the processing bath containing a chemical solution and can thus be etched uniformly.
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