发明授权
- 专利标题： Sputter deposition of hydrogenated amorphous carbon film and applications thereof
- 专利标题（中）： 氢化无定形碳膜的溅射沉积及其应用
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申请号： US781080申请日： 1997-01-09
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公开(公告)号： US5830332A公开(公告)日： 1998-11-03
- 发明人: Edward D. Babich , Alessandro Cesare Callegari , Fuad Elias Doany , Sampath Purushothaman
- 申请人： Edward D. Babich , Alessandro Cesare Callegari , Fuad Elias Doany , Sampath Purushothaman
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： C23C14/06
- IPC分类号： C23C14/06 ; C23C14/34 ; G02B1/10 ; G03F1/00 ; G03F1/26 ; G03F1/32 ; G03F1/34 ; H01L21/205
摘要：
The present invention relates to a method of reactive sputtering for depositing an amorphous hydrogenated carbon film (a-C:H) from an argon/hydrocarbon/hydrogen/oxygen plasma, preferably an Ar/acetylene-helium/hydrogen/oxygen plasma. Such films are optically transparent in the visible range and partially absorbing at ultraviolet (UV) and deep UV (DUV) wavelengths, in particular, 365, and 248, 193 nm. Moreover, the films produced by the present invention are amorphous, hard, scratch resistant, and etchable by excimer laser ablation or by oxygen reactive ion etch process. Because of these unique properties, these films can be used to form a patterned absorber for UV and DUV single layer attenuated phase shift masks. Film absorption can also be increased such that these films can be used to fabricate conventional photolithographic shadow masks.
公开/授权文献
- US5215371A Lamp holder 公开/授权日：1993-06-01
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