发明授权
- 专利标题： Heat transfer apparatus suitable for use in a circuit board assembly
- 专利标题（中）： 适用于电路板组件的传热装置
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申请号： US717055申请日： 1996-09-20
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公开(公告)号： US5831826A公开(公告)日： 1998-11-03
- 发明人: James Edward Van Ryswyk
- 申请人： James Edward Van Ryswyk
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K1/11 ; H05K3/00 ; H05K3/32 ; H05K3/34 ; H05K7/20
摘要：
A heat transfer apparatus is carried on a substrate (204) having top and bottom surfaces (212, 214). The heat transfer apparatus includes a pad (220/222), at least one via (224/226), and a plurality of pads (302). The pad (220/222) is carried on the top surface (212) of the substrate (204) to electrically connect to an electronic component (228/230). The via (224/226) intersects the pad (220/222) and extends between the top and bottom surfaces (212, 214) of the substrate (204). The plurality of pads (302) are carried on the bottom surface (214) of the substrate (204) beneath the pad (220/222). The via (224/226) intersects one of the plurality of pads (302) to transfer heat generated during operation of the electronic component (228/230) thereto.
公开/授权文献
- US5136489A Projective lamp 公开/授权日：1992-08-04
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