发明授权
- 专利标题： Semiconductor device with improved heat dissipation efficiency
- 专利标题（中）： 具有提高散热效率的半导体器件
-
申请号： US609840申请日： 1996-03-01
-
公开(公告)号： US5834831A公开(公告)日： 1998-11-10
- 发明人: Akihiro Kubota , Yuichi Asano , Koichi Sibasaki , Kazuhiro Yonetake , Tsuyoshi Aoki , Akira Takashima
- 申请人： Akihiro Kubota , Yuichi Asano , Koichi Sibasaki , Kazuhiro Yonetake , Tsuyoshi Aoki , Akira Takashima
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX6-192538 19940816; JPX6-303958 19941207; JPX7-207218 19950814
- 主分类号： H01L23/433
- IPC分类号： H01L23/433 ; H01L23/495 ; H01L23/50
摘要：
A thin semiconductor device in which a strength of a lead frame and a heat dissipation efficiency can be improved. The semiconductor device has a semiconductor chip, a lead having an inner lead and an a outer lead continuing to the inner lead, said inner lead having a thin plate portion thinner than the other portion therof, said thin plate portion being electrically connected to said semiconductor chip through a wire and said outer lead serving as an outer connecting terminal, and a sealing resin sealing said semiconductor chip and at least a part of said lead, wherin said inner lead of said lead is positioned on said semiconductor chip.
公开/授权文献
- US4009686A Bird perch 公开/授权日：1977-03-01
信息查询
IPC分类:
