An electrostatic support system for retaining a wafer. The support system generally includes a support body having a support surface for retaining said wafer, a voltage source coupled to the support body for electrostatically coupling the wafer to the support surface, and a cooling system for cooling the wafer. A plurality of arm members extend from the support body to a carriage assembly for releasably mounting the support body to the processing chamber with the support body and the arm members separated from the chamber floor. This invention also includes the method of supporting a wafer in a processing chamber which includes the steps of positioning the wafer on a wafer supporting surface, applying a voltage to an electrode assembly to electrostatically attract the wafer to the support surface and, after processing the wafer, substantially grounding the electrode assembly to sufficiently deactivate the electrostatic charge for release of the wafer from the support surface.