Invention Grant
- Patent Title: Mounting structure for a semiconductor circuit
- Patent Title (中): 半导体电路的安装结构
-
Application No.: US834163Application Date: 1997-04-14
-
Publication No.: US5838546APublication Date: 1998-11-17
- Inventor: Tadayoshi Miyoshi
- Applicant: Tadayoshi Miyoshi
- Applicant Address: JPX Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JPX Tokyo
- Priority: JPX8-115818 19960412
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L23/495 ; H01L25/04 ; H01L25/16 ; H01L25/18 ; H05K1/14 ; H05K1/18 ; H05K3/00 ; H05K1/16
Abstract:
In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output.
Public/Granted literature
- US5480984A Process of preparing high solids low viscosity polysaccharides Public/Granted day:1996-01-02
Information query
IPC分类:
