发明授权
US5844320A Semiconductor unit with semiconductor device mounted with conductive
adhesive
失效
具有安装导电胶的半导体器件的半导体单元
- 专利标题： Semiconductor unit with semiconductor device mounted with conductive adhesive
- 专利标题（中）： 具有安装导电胶的半导体器件的半导体单元
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申请号： US812754申请日： 1997-03-06
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公开(公告)号： US5844320A公开(公告)日： 1998-12-01
- 发明人: Masahiro Ono , Yoshihiro Bessho
- 申请人： Masahiro Ono , Yoshihiro Bessho
- 申请人地址： JPX Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX Osaka
- 优先权： JPX8-049368 19960306
- 主分类号： C09J163/00
- IPC分类号： C09J163/00 ; H01L21/56 ; H01L21/60 ; H05K3/32 ; H01L23/48
摘要：
A semiconductor unit, in which a semiconductor device having protruding electrodes is mounted face down onto the terminal electrodes of a circuit board through a bonding layer made of at least two kinds of conductive adhesive, and a method for manufacturing the semiconductor unit.
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