发明授权
- 专利标题: Method and apparatus for supporting printed board
- 专利标题(中): 支撑印刷电路板的方法和装置
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申请号: US586314申请日: 1996-01-17
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公开(公告)号: US5850689A公开(公告)日: 1998-12-22
- 发明人: Seiichi Mogi , Wataru Hirai , Muneyoshi Fujiwara , Osamu Okuda , Hirokazu Honkawa
- 申请人: Seiichi Mogi , Wataru Hirai , Muneyoshi Fujiwara , Osamu Okuda , Hirokazu Honkawa
- 申请人地址: JPX Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX7-004894 19950117
- 主分类号: B23P19/00
- IPC分类号: B23P19/00 ; H05K13/00 ; H05K13/04 ; H05K3/30
摘要:
A method for supporting a printed board. Includes a first step of conveying to a specified position by a conveying a printed board having a first reference hole and a second reference hole device a for setting a position and posture thereof. A second step stops the conveyed printed board at the specified position with a stop member. A third step inserts a first reference pin provided at the specified position into the first reference hole of the stopped printed board. A fourth step inserts a second reference pin into the second reference hole of the printed board. The second reference pin is movable in parallel to a mounting surface of the printed board and in any arbitrary direction relative to the first reference pin. A fifth step pinches the printed board to hold the position and posture thereof of a holding device with the first reference pin and the second reference pin both inserted. A sixth step draws out, after the fifth step, at least one reference pin of the first reference pin and the second reference pin from its corresponding reference hole. A seventh step mounts after the sixth step, an electronic component onto the printed board under the control of a control unit.
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