发明授权
US5858584A Positive photosensitive resin composition and electronic apparatus using
the same
失效
正型感光性树脂组合物及其使用的电子设备
- 专利标题： Positive photosensitive resin composition and electronic apparatus using the same
- 专利标题（中）： 正型感光性树脂组合物及其使用的电子设备
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申请号： US857675申请日： 1997-05-16
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公开(公告)号： US5858584A公开(公告)日： 1999-01-12
- 发明人: Yoshiaki Okabe , Takao Miwa , Yasunari Maekawa , Takumi Ueno , Geraldine Rames-Langlade , Mina Ishida
- 申请人： Yoshiaki Okabe , Takao Miwa , Yasunari Maekawa , Takumi Ueno , Geraldine Rames-Langlade , Mina Ishida
- 申请人地址： JPX Tokyo JPX Tokyo
- 专利权人： Hitachi, Ltd.,Hitachi Chemical Co., Ltd.
- 当前专利权人： Hitachi, Ltd.,Hitachi Chemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo JPX Tokyo
- 优先权： JPX8-132042 19960527
- 主分类号： G03F7/022
- IPC分类号： G03F7/022 ; C08G73/10 ; C08L79/08 ; C09D179/08 ; G03F7/023 ; G03F7/037
摘要：
A highly reliable positive type photosensitive resin composition composed of diamine having a carboxyl group as a structural unit, which can be developed with an alkaline aqueous solution, comprising polyamic acid ester having hydrophobic group, o-quinonediazidesulfonyl amide compound, and/or o-quinonediazidesulfonyl amide sulfonic ester compound, and electronic devices using the same. A polyamide film having preferable positive type relief patterns, of which the unexposed portion is not corroded, can be obtained.
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