发明授权
US5858884A Nonwoven fabric cloth substrate for printed wiring boards, and prepreg
using the same
失效
印刷电路板用无纺布布基材和使用其的预浸料
- 专利标题： Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same
- 专利标题（中）： 印刷电路板用无纺布布基材和使用其的预浸料
-
申请号： US856548申请日： 1997-05-15
-
公开(公告)号： US5858884A公开(公告)日： 1999-01-12
- 发明人: Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
- 申请人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
- 申请人地址： JPX Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX Osaka
- 优先权： JPX8-120630 19960515
- 主分类号： B32B15/14
- IPC分类号： B32B15/14 ; C08J5/04 ; C09D5/25 ; D04H1/00 ; D04H1/42 ; D04H1/58 ; D21H13/26 ; D21H17/52 ; H05K1/02 ; H05K1/03 ; C08J5/24
摘要：
A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan.delta.) peak value at 30.degree.-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.
公开/授权文献
- US2573679A Control mechanism for door latches 公开/授权日：1951-11-06
信息查询
