公开(公告)号：US5858884A

公开(公告)日：1999-01-12

申请号：US856548

申请日：1997-05-15

申请人： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

发明人： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

IPC分类号： B32B15/14 ,  C08J5/04 ,  C09D5/25 ,  D04H1/00 ,  D04H1/42 ,  D04H1/58 ,  D21H13/26 ,  D21H17/52 ,  H05K1/02 ,  H05K1/03 ,  C08J5/24

CPC分类号： H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

摘要： A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan.delta.) peak value at 30.degree.-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

摘要翻译： 一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基材的预浸料坯和印刷线路板。

公开(公告)号：US6045897A

公开(公告)日：2000-04-04

申请号：US178852

申请日：1998-10-26

申请人： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

发明人： Masayuki Sakai ,  Hideo Hatanaka ,  Masahide Tsukamoto ,  Seiichi Nakatani ,  Masayuki Okano ,  Tamao Kojima

IPC分类号： B32B15/14 ,  C08J5/04 ,  C09D5/25 ,  D04H1/00 ,  D04H1/42 ,  D04H1/58 ,  D21H13/26 ,  D21H17/52 ,  H05K1/02 ,  H05K1/03 ,  D21H13/02

CPC分类号： H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

摘要： A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan .delta.) peak value at 30-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

摘要翻译： 一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基板的预浸料坯和印刷线路板。

公开(公告)号：US6108903A

公开(公告)日：2000-08-29

申请号：US582930

申请日：1996-01-04

申请人： Seiichi Nakatani ,  Akihito Hatakeyama ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Seiichi Nakatani ,  Akihito Hatakeyama ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/10 ,  H05K3/36

CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917

摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.

摘要翻译： 电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。 这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。 通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件，以及设置在填充有导电树脂组合物的所需位置的通孔，直到无粘膜的表面，可以形成 来自可以制造得相当稳定的双面板或四层基板的高多层基板。 除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘性膜分离时，导电糊从有机多孔基材的表面突出出来。 结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

公开(公告)号：US5481795A

公开(公告)日：1996-01-09

申请号：US258383

申请日：1994-06-10

申请人： Akihito Hatakeyama ,  Hiroshi Sogo ,  Tamao Kojima ,  Yasuhiko Horio ,  Masahide Tsukamoto ,  Yasushi Fukumura

发明人： Akihito Hatakeyama ,  Hiroshi Sogo ,  Tamao Kojima ,  Yasuhiko Horio ,  Masahide Tsukamoto ,  Yasushi Fukumura

IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K3/22 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K2201/0116 ,  H05K2201/0269 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/28 ,  H05K3/4623 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes in a porous raw material provided with cover films and having compressive shrinkage, filling electro-conductive paste into the through-holes, separating the cover films from the porous raw material filled with the electro-conductive paste in its through-holes, applying metal foils onto the surfaces of the porous raw material from which the cover films have been separated, and compressing the porous raw material applied with the metal foils through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.

摘要翻译： 一种印刷电路用有机基板的制造方法，其特征在于，包括以下步骤：在设置有覆盖膜的多孔原料中形成通孔，并具有压缩收缩率，将导电性浆料填充到通孔中， 从填充有导电糊的多孔原料在其通孔中，将金属箔施加到已经从其分离了覆盖膜的多孔原料的表面上，并且将施加有金属箔的多孔原料压缩通过 加热和加压，由此将导电浆料中的导电物质连接用于金属箔之间的电连接。

公开(公告)号：US5972482A

公开(公告)日：1999-10-26

申请号：US740261

申请日：1996-10-25

申请人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2201/2072 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4614 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

摘要翻译： 印刷电路板包括具有封闭空隙的未固化衬底材料，所述未固化衬底材料设置有通孔。 当形成通孔时，存在于基板材料中的空隙从通孔的内壁开口形成中空形部分。 通过用导电膏填充通孔和中空形部分，通过导电膏和通孔的壁表面之间的保持效果增加，粘附性得到改善。

公开(公告)号：US5484647A

公开(公告)日：1996-01-16

申请号：US308982

申请日：1994-09-20

申请人： Seiichi Nakatani ,  Akihito Hatakeyama ,  Kouji Kawakita ,  Hirishi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Seiichi Nakatani ,  Akihito Hatakeyama ,  Kouji Kawakita ,  Hirishi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/249996 ,  Y10T442/2475 ,  Y10T442/674

摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree-films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.

摘要翻译： 电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。 这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。 通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件以及设置在导电性树脂组合物的要求位置处的通孔，直到无粘膜的表面，可以形成 来自可以制造得相当稳定的双面板或四层基板的高多层基板。 除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘膜分离时，导电糊从有机多孔基材的表面突出出来。 结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

公开(公告)号：US06326694B1

公开(公告)日：2001-12-04

申请号：US09337407

申请日：1999-06-21

申请人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H01L2348

CPC分类号： H05K3/462 ,  H05K1/0366 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2201/2072 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

摘要翻译： 印刷电路板包括具有封闭空隙的未固化衬底材料，所述未固化衬底材料设置有通孔。 当形成通孔时，存在于基板材料中的空隙从通孔的内壁开口形成中空形部分。 通过用导电膏填充通孔和中空形部分，通过导电膏和通孔的壁表面之间的保持效果增加，粘附性得到改善。

公开(公告)号：US5346750A

公开(公告)日：1994-09-13

申请号：US57972

申请日：1993-05-06

申请人： Akihito Hatakeyama ,  Hiroshi Sogo ,  Tamao Kojima ,  Yasuhiko Horio ,  Masahide Tsukamoto ,  Yasushi Fukumura

发明人： Akihito Hatakeyama ,  Hiroshi Sogo ,  Tamao Kojima ,  Yasuhiko Horio ,  Masahide Tsukamoto ,  Yasushi Fukumura

IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K3/22 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K2201/0116 ,  H05K2201/0269 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  H05K3/28 ,  H05K3/4623 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with cover films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the cover films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the cover films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.

摘要翻译： 一种印刷电路用有机基板的制造方法，其特征在于，包括在设置有覆盖膜（1）并具有压缩收缩率的多孔原料（2）中形成贯通孔（3）的步骤，填充导电浆料 4）插入到通孔（3）中，将覆盖膜（1）与填充有导电膏（4）的多孔原料（2）分离在通孔（3）中，施加金属箔（5） ）到已经分离了覆盖膜（1）的多孔原料（2）的表面上，并且通过加热和加压压缩施加有金属箔（5）的多孔原料（2） 导电浆料中的导电物质被连接用于金属箔之间的电连接。

公开(公告)号：US06211487B1

公开(公告)日：2001-04-03

申请号：US09379008

申请日：1999-08-23

申请人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

发明人： Akihito Hatakeyama ,  Seiichi Nakatani ,  Kouji Kawakita ,  Hiroshi Sogou ,  Tatsuo Ogawa ,  Tamao Kojima

IPC分类号： H05K336

CPC分类号： H05K3/462 ,  H05K1/0366 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0278 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2201/2072 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

公开(公告)号：US6120937A

公开(公告)日：2000-09-19

申请号：US76254

申请日：1998-05-11

申请人： Tamao Kojima ,  Munehiro Tabata ,  Tomoyuki Washizaki ,  Masakazu Tanahashi ,  Yoshiki Murakami ,  Satoshi Kaida ,  Masayoshi Maruta

发明人： Tamao Kojima ,  Munehiro Tabata ,  Tomoyuki Washizaki ,  Masakazu Tanahashi ,  Yoshiki Murakami ,  Satoshi Kaida ,  Masayoshi Maruta

IPC分类号： H01M4/32 ,  H01M4/66 ,  H01M4/80 ,  H01M10/34 ,  H01M4/28

CPC分类号： H01M4/667 ,  H01M4/32 ,  H01M4/80 ,  H01M10/345 ,  Y02E60/124 ,  Y10T29/10

摘要： In a positive electrode for an alkaline storage battery, a layer is formed between a porous substrate as a core material and an active material including nickel hydroxide filled into the porous substrate. The layer includes an oxide containing cobalt and nickel and/or a hydroxide containing cobalt and nickel. In the hydroxide, the average of an oxidation number of a metal is more than +II. The layer has a high electric conductivity while keeping the high corrosion resistance. A utilization rate of the active material can be improved due to the high electric conductivity. An alkaline storage battery including such an electrode has a good cycle property.

摘要翻译： 在碱性蓄电池用正极中，作为芯材的多孔质基材和填充于多孔质基材中的含有氢氧化镍的活性物质形成层。 该层包括含有钴和镍的氧化物和/或含有钴和镍的氢氧化物。 在氢氧化物中，金属的氧化数的平均值大于+ II。 该层具有高导电性，同时保持高耐腐蚀性。 由于高导电性，可以提高活性物质的利用率。 包括这种电极的碱性蓄电池具有良好的循环特性。