发明授权
US5866443A Very dense integrated circuit package and method for forming the same
失效
非常密集的集成电路封装及其形成方法
- 专利标题： Very dense integrated circuit package and method for forming the same
- 专利标题（中）： 非常密集的集成电路封装及其形成方法
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申请号： US884074申请日： 1997-06-27
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公开(公告)号： US5866443A公开(公告)日： 1999-02-02
- 发明人: H. Bernhard Pogge , Johann Greschner , Howard Leo Kalter , Raymond James Rosner
- 申请人： H. Bernhard Pogge , Johann Greschner , Howard Leo Kalter , Raymond James Rosner
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/28
- IPC分类号： H01L21/28 ; H01L21/301 ; H01L21/98 ; H01L25/065 ; H01L29/06 ; H01L21/44
摘要：
Disclosed is an integrated circuit configuration including a carrier having recesses for supporting individual semiconductor die units. The semiconductor die units and the carrier recesses have lithographically defined dimensions so as to enable precise alignment and a high level of integration.
公开/授权文献
- US4168316A Immunosuppressive-1-(thiocarbamoyl)-2-imidazolidinone 公开/授权日：1979-09-18
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