发明授权
- 专利标题： Powdered metal heat sink with increased surface area
- 专利标题（中）： 粉末状金属散热器表面积增加
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申请号： US854780申请日： 1997-05-12
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公开(公告)号： US5869891A公开(公告)日： 1999-02-09
- 发明人: Michael D. Rostoker , Mark Schneider
- 申请人： Michael D. Rostoker , Mark Schneider
- 申请人地址： CA Milpitas
- 专利权人： LSI Logic Corporation
- 当前专利权人： LSI Logic Corporation
- 当前专利权人地址： CA Milpitas
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/367 ; H01L23/34 ; H01L23/10
摘要：
A method and apparatus for dissipating heat from a semiconductor device. A heat sink embodying the method includes an exterior surface contoured to better facilitate heat dissipation and/or direct a flow of air or fluid over the heat sink. In one embodiment, the heat sink includes a heat sink layer formed from a powdered metal. In another embodiment, the heat sink layer is contoured with a selected combination of bumps, indentations and holes. In yet another embodiment, the heat sink includes a stack of such heat sink layers which are mechanical; interfitted and thermally coupled.
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