发明授权
- 专利标题: Low emissions method for spray application of conformal coating to electronic assemblies
- 专利标题(中): 喷涂适用于电子组件的适形涂层的低排放方法
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申请号: US721514申请日: 1996-09-26
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公开(公告)号: US5871822A公开(公告)日: 1999-02-16
- 发明人: Thomas G. Lepsche , James M. Henz
- 申请人: Thomas G. Lepsche , James M. Henz
- 申请人地址: MN Minneapolis
- 专利权人: Honeywell Inc.
- 当前专利权人: Honeywell Inc.
- 当前专利权人地址: MN Minneapolis
- 主分类号: H05K3/00
- IPC分类号: H05K3/00 ; H05K3/28 ; B05D1/02 ; B05D3/02 ; B05D5/12
摘要:
An apparatus and method for applying a conformal coat to an electronic assembly which significantly reduces the emissions which are a by-product of the process. A spray gun atomizes a conformal coat/solvent mixture at a high pressure within the gun and then emits the mixture at a low volume and low pressure such that the transfer rate of the material is very high and the amount of wasted material is very low. The coats are applied in such a manner that the electronic assembly can be sprayed multiple times before sending the entire assembly into the curing oven.
公开/授权文献
- US5233020A Paint binders 公开/授权日:1993-08-03
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