发明授权
- 专利标题： Method for adhering a metallization to a substrate
- 专利标题（中）： 将金属化粘附到基底的方法
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申请号： US944506申请日： 1997-10-06
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公开(公告)号： US5882954A公开(公告)日： 1999-03-16
- 发明人: Ram Singh Raghava , Andrew Z. Glovatsky , Jay DeAvis Baker , Michael George Todd
- 申请人： Ram Singh Raghava , Andrew Z. Glovatsky , Jay DeAvis Baker , Michael George Todd
- 申请人地址： MI Dearborn
- 专利权人： Ford Motor Company
- 当前专利权人： Ford Motor Company
- 当前专利权人地址： MI Dearborn
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H05K3/14 ; H05K3/16 ; H05K3/38 ; H01L21/44 ; H01L21/50
摘要：
There is disclosed herein a method for adhering metallizations to a substrate, comprising the steps of: (1) providing a substrate having a first surface; (2) applying a coating atop the first surface, such that the coating has a second surface bonded to the first surface, and a third surface generally conforming with the second surface; (3) etching away material from the third surface, so as to roughen and form pits in the third surface; and (4) attaching a metallization to the pits in the third surface by plating, sputtering, or similar means.
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