发明授权
- 专利标题： Process for producing semiconductor device
- 专利标题（中）： 半导体器件的制造方法
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申请号： US786659申请日： 1997-01-21
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公开(公告)号： US5882956A公开(公告)日： 1999-03-16
- 发明人: Norito Umehara , Masazumi Amagai , Mamoru Kobayashi , Kazuyoshi Ebe
- 申请人： Norito Umehara , Masazumi Amagai , Mamoru Kobayashi , Kazuyoshi Ebe
- 申请人地址： JPX JPX
- 专利权人： Texas Instruments Japan Ltd.,Lintec Corporation
- 当前专利权人： Texas Instruments Japan Ltd.,Lintec Corporation
- 当前专利权人地址： JPX JPX
- 优先权： JPX8-008049 19960122
- 主分类号： H01L21/301
- IPC分类号： H01L21/301 ; H01L21/304 ; H01L21/68 ; H01L23/495 ; H01L21/208
摘要：
A process for manufacturing a wafer dicing/bonding sheet of the present invention comprises a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive layer and a polyimide adhesive layer formed on the processing film. It is preferred that the processing film be a polyethylene naphthalate film whose surface has been subjected to an alkyd release treatment. The present invention facilitates expansion to be conducted after the wafer dicing.
公开/授权文献
- US4650293A Albada finder optical system of inverted Galilean type 公开/授权日：1987-03-17
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