The present invention is a multi-layer film which has an improved composite structure for providing hermetic seals to packages manufactured in high speed packaging apparatus. The structure of the multi-layer film of the present invention includes a main substrate and a sealant layer. The sealant layer, in turn, includes two components, an intermediate layer which has the primary function of compliance during sealing, and a sealing layer which has the primary function of providing adhesivity to the completed seal. As a result of this invention, high strength hermetic seals can be provided to multi-layer films effectively and efficiently, and hermetic seals are provided with the ability to be peeled open without destruction of several layers of the film.