发明授权
US5892179A Solder bumps and structures for integrated redistribution routing
conductors
失效
用于集成再分配布线导体的焊料凸块和结构
- 专利标题： Solder bumps and structures for integrated redistribution routing conductors
- 专利标题（中）： 用于集成再分配布线导体的焊料凸块和结构
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申请号： US977258申请日： 1997-11-24
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公开(公告)号： US5892179A公开(公告)日： 1999-04-06
- 发明人: Glenn A. Rinne , Joseph Daniel Mis
- 申请人： Glenn A. Rinne , Joseph Daniel Mis
- 申请人地址： NC Research Triangle Park
- 专利权人： MCNC
- 当前专利权人： MCNC
- 当前专利权人地址： NC Research Triangle Park
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485 ; H01R9/09
摘要：
A solder bump structure on a microelectronic substrate including an electrical contact having an exposed portion. This solder bump structure includes an under bump metallurgy structure on the microelectronic substrate, and a solder structure on the under bump metallurgy structure opposite the microelectronic substrate. The metallurgy structure includes an elongate portion having a first end which electronically contacts the exposed portion of the electrical contact and an enlarged width portion connected to a second end of the elongate portion. The solder structure includes an elongate portion on the metallurgy structure and an enlarged width portion on the enlarged width portion of the metallurgy structure. Accordingly, the enlarged width portion of the solder structure can be formed on a portion of the microelectronic substrate other than the contact pad and still be electronically connected to the pad.
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