Low temperature methods of bonding components
    8.
    发明授权
    Low temperature methods of bonding components 有权
    粘接部件的低温方法

    公开(公告)号:US06863209B2

    公开(公告)日:2005-03-08

    申请号:US10017350

    申请日:2001-12-14

    IPC分类号: B23K1/00 B23K31/02

    摘要: Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the metal while bonding. Related structures are also discussed.

    摘要翻译: 粘合两个部件的方法可以包括相对于彼此定位组件以获得期望的取向。 一旦获得了所需的取向,就可以将金属成分按期望的方向与金属结合,其中两种成分的温度在粘合时保持在金属的熔融温度以下。 还讨论了相关结构。

    Trilayer/bilayer solder bumps and fabrication methods therefor
    9.
    发明授权
    Trilayer/bilayer solder bumps and fabrication methods therefor 有权
    三层/双层焊料凸块及其制造方法

    公开(公告)号:US06492197B1

    公开(公告)日:2002-12-10

    申请号:US09576477

    申请日:2000-05-23

    申请人: Glenn A. Rinne

    发明人: Glenn A. Rinne

    IPC分类号: H01L2144

    摘要: Solder bumps are fabricated by plating a first solder layer on an underbump metallurgy, plating a second solder layer having higher melting point than the first solder layer on the first solder layer and plating a third solder layer having lower melting point than the second solder layer on the second solder layer. The structure then is heated to below the melting point of the second solder layer but above the melting point of the first solder layer and the third solder layer, to alloy at least some of the first solder layer with at least some of the underbump metallurgy and to round the third solder layer. Accordingly, a trilayer solder bump may be fabricated wherein the first and third layers melt at lower temperatures than the second solder layer, to thereby round the outer surface of the solder bump and alloy the base of the solder bump to the underbump metallurgy, while allowing the structure of the intermediate layer to be preserved. Solder bump fabrication as described above may be particularly useful with lead-tin solder wherein the first solder layer is eutectic lead-tin solder, the second solder layer is lead-tin solder having higher lead content than eutectic lead-tin solder and the third solder layer is eutectic lead-tin solder. In yet other embodiments, the thickness and/or composition of the outer underbump metallurgy layer and/or of the first solder layer may be selected so that upon heating, sufficient tin from the first solder layer is alloyed with at least some of the outer underbump metallurgy layer, such that the first solder layer is converted to a fourth solder layer having the same lead content as the second solder layer. Bilayer solder bumps thereby may be provided.

    摘要翻译: 通过在下焊管冶金上电镀第一焊料层,在第一焊料层上电镀具有比第一焊料层更高的熔点的第二焊料层并且将具有比第二焊料层低的熔点的第三焊料层电镀到第二焊料层上来制造焊料凸块 第二焊料层。 然后将该结构加热到低于第二焊料层的熔点但高于第一焊料层和第三焊料层的熔点,以使第一焊料层中的至少一些与至少一些下焊管冶金和 绕第三个焊料层。 因此,可以制造三层焊料凸块,其中第一和第三层在比第二焊料层更低的温度下熔化,从而使焊料凸块的外表面圆周化,并将焊料凸块的底部合金到底部焊接冶金,同时允许 待保存的中间层的结构。 如上所述的焊料凸块制造对于铅锡焊料尤其有用,其中第一焊料层是共晶铅锡焊料,第二焊料层是比共晶铅锡焊料具有更高铅含量的铅锡焊料,而第三焊料 层是共晶铅锡焊料。 在另外的其它实施例中,可以选择外部底部基质金属层和/或第一焊料层的厚度和/或组成,使得在加热时,来自第一焊料层的足够的锡与至少一些外部底部基底 使得第一焊料层被转换成具有与第二焊料层相同的铅含量的第四焊料层。 可以提供双层焊料凸块。

    Fluorinated fluxless soldering
    10.
    发明授权
    Fluorinated fluxless soldering 失效
    氟化无焊剂焊接

    公开(公告)号:US5615825A

    公开(公告)日:1997-04-01

    申请号:US439591

    申请日:1995-05-12

    IPC分类号: B23K35/38 H05K3/34

    摘要: A method for pretreating a solder surface for fluxless soldering is disclosed. The method uses a noble fluorine gas to remove surface oxides from solder surfaces, without the use of external stimulation. A noble fluorine gas is suffused across the solder surface to reduce or eliminate or chemically convert the surface oxides. The process can take place at atmospheric pressure and room temperature. A simple belt driven transport may be used to move the parts past a nozzle which emits the vapor in a system similar to a conventional solder reflow machine.

    摘要翻译: 公开了一种用于无焊剂焊接的焊料表面的预处理方法。 该方法使用贵金属氟气从表面除去表面氧化物,而不需要外部刺激。 在焊料表面上充满贵重氟气以减少或消除或化学转化表面氧化物。 该过程可以在大气压和室温下进行。 可以使用简单的皮带驱动输送来将部件移动通过类似于常规的回流焊机的系统中的喷嘴而喷出蒸气。