发明授权
- 专利标题： Sensing element lead wire connecting structure
- 专利标题（中）： 感应元件引线连接结构
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申请号： US863206申请日： 1997-05-27
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公开(公告)号： US5894409A公开(公告)日： 1999-04-13
- 发明人: Junko Tanaka
- 申请人： Junko Tanaka
- 申请人地址： JPX Tokyo
- 专利权人： Yazaki Corporation
- 当前专利权人： Yazaki Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX8-135114 19960529
- 主分类号： G01G3/15
- IPC分类号： G01G3/15 ; G01D11/24 ; G01G19/08 ; G01G19/12 ; G01L1/12 ; H01R4/00 ; H01R13/66 ; G01G3/14
摘要：
A sensing element lead wire connecting structure is provided for stably connecting conductors, forming the coil of a sensing element for load measurement, with the lead wires for external connection. In the sensing element lead wire connecting structure, a flexible circuit board is fixed to a base member receiving an applied load to be measured. Conductive patterns are formed on the circuit board and are electrically connected to the lead wires for externally outputting the load measurement.
公开/授权文献
- US4770389A Electric valve device 公开/授权日：1988-09-13
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