发明授权
US5894882A Heat sink structure for cooling a substrate and an electronic apparatus
having such a heat sink structure
失效
用于冷却衬底的散热器结构和具有这种散热器结构的电子设备
- 专利标题： Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure
- 专利标题（中）： 用于冷却衬底的散热器结构和具有这种散热器结构的电子设备
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申请号： US650029申请日： 1996-05-17
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公开(公告)号： US5894882A公开(公告)日： 1999-04-20
- 发明人: Shunichi Kikuchi , Minoru Hirano , Kiyotaka Seyama , Hideaki Yoshimura , Takashi Kanda , Hitoshi Nori
- 申请人： Shunichi Kikuchi , Minoru Hirano , Kiyotaka Seyama , Hideaki Yoshimura , Takashi Kanda , Hitoshi Nori
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX5-030901 19930219
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; F28F3/02 ; H01L23/367 ; H01L23/467 ; F28F7/00 ; H01L23/46
摘要：
A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.
公开/授权文献
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