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55 条记录 (耗时 0.03 秒)

    Wiring substrate and method of manufacturing the same
    6.
    发明授权
    Wiring substrate and method of manufacturing the same 有权
    接线基板及其制造方法

    公开(公告)号：US07999193B2

    公开(公告)日：2011-08-16

    申请号：US12247471

    申请日：2008-10-08

    申请人： Katsuya Fukase ,  Kishio Yokouchi ,  Hideaki Yoshimura

    发明人： Katsuya Fukase ,  Kishio Yokouchi ,  Hideaki Yoshimura

    IPC分类号： H05K1/11

    CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10416 ,  Y10T29/49124

    摘要： There is provided a wiring substrate. The wiring substrate includes: a core substrate formed of a conductive material and having a through hole therein; an insulating layer formed on first and second surfaces of the core substrate; wiring patterns formed on the first and second surfaces via the insulating layer; and a via formed in the through hole and electrically connected to the wiring patterns. The via includes: a conductor ball and a conductor portion. The conductor ball has a conductive surface and an insulating member covering the conductive surface. A portion of the conductive surface is exposed from the insulating member. The conductor portion is electrically connected to the exposed conductive surface and the wiring patterns. At least one of the insulating member and the insulating layer is interposed between the via and the core substrate.

    摘要翻译： 提供了布线基板。 布线基板包括：由导电材料形成并在其中具有通孔的芯基板; 绝缘层，形成在所述芯基板的第一和第二表面上; 通过绝缘层在第一和第二表面上形成的布线图案; 以及形成在通孔中并且电连接到布线图案的通孔。 通孔包括：导体球和导体部分。 导体球具有导电表面和覆盖导电表面的绝缘构件。 导电表面的一部分从绝缘构件露出。 导体部分电连接到暴露的导电表面和布线图案。 绝缘构件和绝缘层中的至少一个介于通路和芯基板之间。

    Printed circuit board unit and semiconductor package
    8.
    发明申请
    Printed circuit board unit and semiconductor package 有权
    印刷电路板单元和半导体封装

    公开(公告)号：US20100014254A1

    公开(公告)日：2010-01-21

    申请号：US12461867

    申请日：2009-08-26

    申请人： Kenji Fukuzono ,  Hideaki Yoshimura

    发明人： Kenji Fukuzono ,  Hideaki Yoshimura

    IPC分类号： H05K7/20 ,  H01L23/48 ,  H01L23/36

    CPC分类号： H01L23/4006 ,  H01L21/10 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/433 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/0401

    摘要： A terminal bump set including the outermost bump row inscribed in a first prism standing upright on the front surface of a package substrate. A heat conductive member contacts with the surface of the semiconductor element. The heat conductive member extends outward beyond the contour of the semiconductor element. A reinforcing member is interposed between the heat conductive member and the package substrate outside the contour of the semiconductor element. The reinforcing member is bonded to the front surface of the package substrate at a predetermined bonding area. The predetermined bonding area extends inward from the outer periphery of the package substrate over the front surface of the package substrate. The second prism stands upright on the front surface of the package substrate inside the first prism so as to allow the outermost bump row to circumscribe the second prism.

    摘要翻译： 一种端子凸块组，包括内嵌在封装基板前表面上的直立的第一棱镜中的最外凸块排。 导热构件与半导体元件的表面接触。 导热构件向外延伸超过半导体元件的轮廓。 在半导体元件的轮廓外部的导热构件和封装基板之间插入加强构件。 加强构件在预定的接合区域结合到封装基板的前表面。 预定的结合区域从封装基板的外周向内延伸超过封装基板的前表面。 第二棱镜直立在第一棱镜内部的封装基板的前表面上，以允许最外面的凸起行包围第二棱镜。