发明授权
- 专利标题： Lead frame and semiconductor package
- 专利标题（中）： 引线框和半导体封装
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申请号： US785592申请日： 1997-01-17
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公开(公告)号： US5898212A公开(公告)日： 1999-04-27
- 发明人: Sun Dong Kim
- 申请人： Sun Dong Kim
- 申请人地址： KRX Cheongju
- 专利权人： LG Semicon Co., Ltd.
- 当前专利权人： LG Semicon Co., Ltd.
- 当前专利权人地址： KRX Cheongju
- 优先权： KRX96-21536 19960614
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/28 ; H01L23/495 ; H01L23/50
摘要：
A lead frame includes a first lead and a second lead formed on the first lead. The second lead may comprise a conductive adhesive and a conductive layer attached to the first lead. Such leads may be used for a package where the second leads are exposed on the outside exterior of a molded resin and/or a semiconductor chip has a plurality of center chip pads.
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