摘要:
An instruction decoding unit in a microcomputer is disclosed having an instruction word capable of being selected by a user to conveniently produce application software while maintaining security. The decoding unit in a microcomputer includes an instruction register for storing instructions fetched from a memory, an instruction decoder for decoding instruction codes of the instructions stored in the instruction register and for designating micro-instructions to be executed, a micro-ROM for outputting a series of the micro-instructions designated by the instruction decoder, and a user instruction selector for selecting or changing the micro-instructions of the micro-ROM in response to user's selection so as to change the operation of an instruction word.
摘要:
A semiconductor wafer cleaning apparatus comprises an outer tank, a cleaning tank provided within the outer tank, a wafer carrier provided within the cleaning tank, a plurality of jet nozzles directed toward the wafer carrier, a main pipe connected to the jet nozzles, a circulating pump connected to the main pipe and the outer tank for circulating a cleansing solution from the outer tank, through the main pipe, the jet nozzles, and the cleaning tank, and a filter for filtering the circulated cleansing solution.
摘要:
Disclosed are a method for forming a structure of wires for a semiconductor device in which pads are formed for contact in cell regions as well as core regions and periphery regions where cell aspect ratios are very high, and a structure of wires so formed. The semiconductor device includes a semiconductor substrate arranged into cell regions and periphery and/or core regions, the periphery and/or core regions having a well formed in the semiconductor substrate, the semiconductor substrate being arranged into active regions and field regions, the semiconductor device also having field insulating layers in the field regions, plural gate structures on portions of the semiconductor substrate in the active regions, and impurity regions in the semiconductor substrate between the gate structures. The method includes the steps of: forming an interlayer insulating structure on the semiconductor device; forming contact holes through the interlayer insulating structure to expose the impurity regions; lining contact-hole-portions of the interlayer insulating layer with portions of a barrier layer, respectively, such that the portions of the barrier layer contact the impurity regions; forming conductive pads on the portions of the barrier layer such that remainders of the contact holes are filled; and forming a wire layer on each one of the conductive pads.
摘要:
A semiconductor device and a method for manufacturing the same that forms a self-aligned contact hole between two gate lines. A substrate is provided that has a first gate line formed thereon. An insulator is formed on the first gate line and substrate. Then a portion of the insulator and a portion of the first gate line is selectively removed to split the first gate line into a second gate line and a third gate line and to concurrently expose the substrate. Thus, producing a self-aligned contact hole between the second and third gate lines.
摘要:
YUV to RGB converter for converting a digital YUV signal having a Y signal, a U signal, and a V signal to a digital RGB signal having an R signal, a G signal, and a B signal according to equations:R=Y+N.sub.1 .times.VG=Y-N.sub.2 .times.V-N.sub.3 .times.UB=Y+N.sub.4 .times.Uwherein the YUV to RGB converter performs only bit shifting and adding/subtracting operations, and N.sub.1, N.sub.2, N.sub.3, and N.sub.4 are constants.
摘要翻译:YUV至RGB转换器,用于根据以下等式将具有Y信号,U信号和V信号的数字YUV信号转换为具有R信号,G信号和B信号的数字RGB信号:R = Y + N1×VG = Y-N2xV-N3xUB = Y + N4xU其中YUV到RGB转换器仅执行位移和加法/减法运算,N1,N2,N3和N4是常数。
摘要:
A metal-oxide-semiconductor (MOS) device in which the nonuniform dopant concentration in the channel region is obtained by means of ion implantation through a polysilicon gate electrode of nonuniform cross section, which is itself obtained by oxidizing the polysilicon using a semirecessed LOCOS process. The present invention is directed most generally to a semiconductor device which includes: a semiconductor substrate of a first conductivity type; a gate insulator on the substrate, the gate insulator sharing an interface with the substrate; a gate electrode on the gate insulator, the gate electrode having a first side, a second side, and a middle region between the first and second sides; a source doped region of a second conductivity type within the substrate to the first side of the gate electrode and a drain doped region of the second conductivity type within the substrate to the second side of the gate electrode, the source and drain doped regions self-aligned to the gate electrode; and a channel doped region of the first conductivity type within the substrate below the gate electrode, the channel doped region having a peak dopant concentration profile such that the peak dopant concentration under the middle region of the gate electrode occurs further below the gate insulator-substrate interface than does either the peak dopant concentration under the first side of the gate electrode or the peak dopant concentration under the second side of the gate electrode.
摘要:
An interconnection fabricating method for a semiconductor device includes the steps of forming an interconnection layer on a semiconductor substrate, forming a first photoresist layer on the interconnection layer, forming an insulation layer on the first photoresist layer, forming a second photoresist layer pattern on the insulation layer, sequentially etching the insulation layer and the first photoresist layer to obtain an insulation layer pattern and a first photoresist layer pattern, and removing the second photoresist layer pattern, removing the insulation layer pattern using dry etching, and forming an interconnection layer pattern by selectively etching the interconnection layer.
摘要:
A solid state image pickup device including implanting impurity ions into a planarizing layer and/or a microlens layer thereon for changing a refractive index thereof, and method for fabricating such a device. The planarizing layer and the microlens layer are formed over components of the solid state image pickup device including a plurality of photoelectric conversion regions and charge coupled device (CCD) regions, each charge coupled device transferring an image charge generated in the photoelectric conversion regions in one direction.
摘要:
A signal compressing apparatus is disclosed, which controls output signal in case of exceeding input signal to increase transmission efficiency and obtains stable output due to temperature compensation. The signal compressing apparatus includes an amplifier for amplifying an input signal applied through an input resistor connected to an input terminal at a constant gain, and a gain controller for rectifying only a specific band signal of output signals of the amplifier between the input terminal of the amplifier and an output terminal thereof, compensating temperature of the rectified signal, and outputting a control signal to allow the gain of the amplifier to be constant.
摘要:
A method of fabricating a nonvolatile memory device having a substrate, includes the steps of forming a plurality of bit lines in the substrate, forming a plurality of field oxide layers on the substrate perpendicular to the bit lines, forming a gate insulating layer on an entire surface of the substrate including the bit lines and the field oxide layers, forming a plurality of floating lines on the gate insulating layer between the bit lines, forming a dielectric layer on the entire surface of the semiconductor substrate including the floating line's and the gate insulating layer, forming a plurality of word lines between the field oxide layer perpendicular to the bit lines, forming sidewall spacer at both sides of the word lines, selectively removing the dielectric layer and the floating lines using the word lines and the sidewall spacer as masks to form a plurality of floating gates, forming a tunneling layer at both sides of the floating gates, and forming a plurality of program lines between the bit lines.