A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26) and overlies the via opening (30). The protuberance (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the protuberance (20) and the terminal (24).