发明授权
- 专利标题： Bump levelling method and bump levelling apparatus
- 专利标题（中）： 凸块调平方法和凸块调平装置
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申请号： US985204申请日： 1997-12-04
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公开(公告)号： US5899140A公开(公告)日： 1999-05-04
- 发明人: Akihiro Yamamoto , Makoto Imanishi , Takahiro Yonezawa , Shinzo Eguchi , Osamu Nakao
- 申请人： Akihiro Yamamoto , Makoto Imanishi , Takahiro Yonezawa , Shinzo Eguchi , Osamu Nakao
- 申请人地址： JPX
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX8-324479 19961205
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/00 ; B30B15/14
摘要：
A bump leveling method and a bump leveling apparatus in which the leveled height of bumps can be made constant and meet the change in thickness of an IC chip. A pressing force under which one bump is deformed to a prescribed height is measured. Thus, the pressing force under which a plurality of bumps can be deformed and leveled can be set. A load cell detects that a prescribed pressing force is exerted on the bumps and this pressing force is maintained, so that the plurality of bumps can be leveled up to the same prescribed height.
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