公开(公告)号：US5899140A

公开(公告)日：1999-05-04

申请号：US985204

申请日：1997-12-04

申请人： Akihiro Yamamoto ,  Makoto Imanishi ,  Takahiro Yonezawa ,  Shinzo Eguchi ,  Osamu Nakao

发明人： Akihiro Yamamoto ,  Makoto Imanishi ,  Takahiro Yonezawa ,  Shinzo Eguchi ,  Osamu Nakao

IPC分类号： H01L21/60 ,  H01L21/00 ,  B30B15/14

CPC分类号： H01L21/67092

摘要： A bump leveling method and a bump leveling apparatus in which the leveled height of bumps can be made constant and meet the change in thickness of an IC chip. A pressing force under which one bump is deformed to a prescribed height is measured. Thus, the pressing force under which a plurality of bumps can be deformed and leveled can be set. A load cell detects that a prescribed pressing force is exerted on the bumps and this pressing force is maintained, so that the plurality of bumps can be leveled up to the same prescribed height.

摘要翻译： 可以使凸块的调平高度恒定并满足IC芯片的厚度变化的凸块调平方法和凸块调平装置。 测量一个凸块变形到规定高度的压力。 因此，可以设定多个凸块能够变形和平整的按压力。 称重传感器检测到凸起上施加了规定的按压力，并且保持该按压力，使得多个凸块能够达到相同的规定高度。

公开(公告)号：US06481616B2

公开(公告)日：2002-11-19

申请号：US09978872

申请日：2001-10-17

申请人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

发明人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

IPC分类号： B23K3102

CPC分类号： H01L21/68 ,  H01L21/321 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00

摘要： To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

摘要翻译： 为了消除电子零件的破损或接合不良，提高电子零件的可靠性，在凸块焊接装置中调节电子部件。 一种凸块接合装置，包括用于安装和加热电子部件的台架1和包括具有用于定位电子部件的侧面的可旋转调节板2的位置调节装置，具有用于与电子部件配合的侧面的板4 调节板和用于向调节板施加调节力以便将电子部件按压到板4的调节弹簧5。

公开(公告)号：US06328196B1

公开(公告)日：2001-12-11

申请号：US09202567

申请日：1998-12-17

申请人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

发明人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

IPC分类号： B23Q900

CPC分类号： H01L21/68 ,  H01L21/321 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00

摘要： To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

摘要翻译： 为了消除电子零件的破损或接合不良，提高电子零件的可靠性，在凸块焊接装置中调节电子部件。 一种凸块接合装置，包括用于安装和加热电子部件的台架1和包括具有用于定位电子部件的侧面的可旋转调节板2的位置调节装置，具有用于与电子部件配合的侧面的板4 调节板和用于向调节板施加调节力以便将电子部件按压到板4的调节弹簧5。

公开(公告)号：US6017812A

公开(公告)日：2000-01-25

申请号：US119974

申请日：1998-07-21

申请人： Takahiro Yonezawa ,  Osamu Nakao ,  Shinji Kanayama ,  Akihiro Yamamoto ,  Makoto Imanishi ,  Koichi Yoshida

发明人： Takahiro Yonezawa ,  Osamu Nakao ,  Shinji Kanayama ,  Akihiro Yamamoto ,  Makoto Imanishi ,  Koichi Yoshida

IPC分类号： H01L21/60 ,  H01L21/607 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

摘要： The present invention provides a bump bonding method that can prevent bumps from being inappropriately shaped. The bump bonding method comprises forming a gold ball (16) at the tip of a gold wire (1) that is inserted through a capillary (3), lowering the capillary (3) while using a displacement detection sensor to detect the vertical displacement of the capillary (3), detecting the position of that portion of an IC (11) in which an electrode is formed, based on the displacement of the capillary (3) detected by the displacement detection sensor when the gold ball (16) abuts the IC (11), pressing he gold ball (16) against the electrode forming portion to form a bump pedestal (17), elevating the capillary (3) a specified amount while moving it in the horizontal direction a specified amount, setting the height S of a position at which the capillary (3) is stopped based on the height H1 of the bump pedestal (17) detected by the displacement detection sensor, again lowering the capillary (3) down to the stop position height S to join the gold wire (1) to the bump pedestal (17), and then lifting the gold wire (1) to break the joint between the bump pedestal (17) and the gold wire (1).

摘要翻译： 本发明提供一种能够防止凸块不适当地形成的凸块接合方法。 凸点接合方法包括在金线（1）的尖端处形成金球（16），该金球插入通过毛细管（3），同时使用位移检测传感器来降低毛细管（3），以检测垂直位移 所述毛细管（3）基于当所述金球（16）邻接所述位置检测传感器时检测到的所述毛细管（3）的位移，检测形成有电极的所述IC（11）的所述部分的位置 IC（11），将金球（16）压在电极形成部分上以形成凸起基座（17），在毛细管（3）沿水平方向移动一定量的同时将毛细管（3）提高一定量，将高度S 基于由位移检测传感器检测到的凸起基座（17）的高度H1停止毛细管（3）的位置，再次将毛细管（3）降低到停止位置高度S，从而将金线 （1）到凸台（17），然后抬起g 旧电线（1），以破坏凸块基座（17）和金线（1）之间的接合部。

公开(公告)号：US5899375A

公开(公告)日：1999-05-04

申请号：US936616

申请日：1997-09-24

申请人： Koichi Yoshida ,  Akihiro Yamamoto ,  Takahiro Yonezawa ,  Makoto Imanishi

发明人： Koichi Yoshida ,  Akihiro Yamamoto ,  Takahiro Yonezawa ,  Makoto Imanishi

IPC分类号： B23K20/00 ,  H01L21/60 ,  H01L21/66 ,  B23K37/00 ,  B23K1/06

CPC分类号： H01L24/83 ,  B23K20/007 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/78901 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85045 ,  H01L2224/85148 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781

摘要： The object is to provide a bump bonder wherein the drop of the tact efficiency of bump formation can be reduced to a low level by discard-bonding of unsatisfactory balls (3) so that satisfactory bumps can be formed. It features arranging a discard bonding chip (19) on bonding stage (17), which holds in their prescribed positions the semiconductor chips (13a), (13b) that are to be subjected to bump formation and performing discard bonding to discard bonding chip (19). Due to this construction, discard bonding can be effected without needing to move the capillary far from the bonding stage (17), which is the working position.

摘要翻译： 本发明的目的是提供一种凸块焊接机，其中通过不令人满意的球（3）的废弃结合可以将凸点形成的节拍效率的下降降低到较低的水平，从而可以形成令人满意的凸块。 其特征在于，在接合台（17）上配置有放弃接合用芯片（19），所述接合台（17）保持其规定位置，使要进行凸点形成的半导体芯片（13a），（13b）进行放弃接合以丢弃接合芯片 19）。 由于这种结构，可以在不需要将毛细管远离作为工作位置的接合台（17）的情况下进行废弃粘合。

公开(公告)号：US07246430B2

公开(公告)日：2007-07-24

申请号：US10857940

申请日：2004-06-02

申请人： Takahiro Yonezawa ,  Ken Kobayashi ,  Mikio Hasegawa ,  Hiroshi Nasu ,  Makoto Imanishi ,  Katsuhiko Watanabe

发明人： Takahiro Yonezawa ,  Ken Kobayashi ,  Mikio Hasegawa ,  Hiroshi Nasu ,  Makoto Imanishi ,  Katsuhiko Watanabe

IPC分类号： B23P19/00

CPC分类号： H05K13/0413 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K13/082 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191 ,  H01L2924/00

摘要： In an electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that has piezoelectric elements provided in a stack in a mounting direction of the electronic component. Therefore, a size in a horizontal direction of the load sensor can be reduced, and a load applied to the electronic component can be detected at a neighborhood of a mounting position of the electronic component. Moreover, by comparing a position, in a two-dimensional space in which load values in an X-direction and Y-direction of the horizontal load serve as coordinate values, with a tolerance range in the two-dimensional space, a mounting failure can be detected from a deviation in the horizontal loads.

摘要翻译： 在电子部件安装装置中，通过负载传感器检测施加到电子部件的垂直负载和水平负载，所述负载传感器具有沿电子部件的安装方向设置在堆叠中的压电元件。 因此，可以减小负载传感器的水平方向的尺寸，并且能够在电子部件的安装位置附近检测施加于电子部件的负荷。 此外，通过将二维空间中的水平载荷的X方向和Y方向的负荷值作为坐标值的二维空间与二维空间中的公差范围进行比较，可以将安装失败 从水平载荷的偏差中检测。

公开(公告)号：US06619535B1

公开(公告)日：2003-09-16

申请号：US09830508

申请日：2001-04-27

申请人： Makoto Imanishi ,  Takahiro Yonezawa ,  Shinji Kanayama ,  Ryoichiro Katano ,  Takaharu Mae

发明人： Makoto Imanishi ,  Takahiro Yonezawa ,  Shinji Kanayama ,  Ryoichiro Katano ,  Takaharu Mae

IPC分类号： B23K3102

CPC分类号： H01L21/6838 ,  H01L21/68 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a construction including a stage having a suction hole for sucking an electronic component and fixing the same in position and position regulating suction hole for sucking an electronic component when the electronic component is regulated in position, a position regulating pawl for positioning the electronic component on the stage and a position regulating suction force control section capable of controlling a position regulating suction force when the electronic component is regulated in position on the stage.

摘要翻译： 本发明提供一种结构，其特征在于，包括具有用于吸引电子部件的吸引孔并将其固定在适当位置的台阶的结构，以及当电子部件被调节就位时，用于吸引电子部件的位置调节用吸孔; 以及位置调整用吸引力控制部，其能够控制在电子部件被调节到台上的位置时调节吸引力的位置。

公开(公告)号：US20050071991A1

公开(公告)日：2005-04-07

申请号：US10857940

申请日：2004-06-02

申请人： Takahiro Yonezawa ,  Ken Kobayashi ,  Mikio Hasegawa ,  Hiroshi Nasu ,  Makoto Imanishi ,  Katsuhiko Watanabe

发明人： Takahiro Yonezawa ,  Ken Kobayashi ,  Mikio Hasegawa ,  Hiroshi Nasu ,  Makoto Imanishi ,  Katsuhiko Watanabe

IPC分类号： B23Q15/00 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H05K13/04

CPC分类号： H05K13/0413 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K13/082 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191 ,  H01L2924/00

摘要： In the electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that have piezoelectric elements provided in a stack in the mounting direction of the electronic component. Therefore, the size in the horizontal direction of the load sensor can be reduced, and the load applied to the electronic component can be detected at the neighborhood of the mounting position of the electronic component. Moreover, by comparing a position in a two-dimensional space in which the load values in the X-direction and the Y-direction of the horizontal load are served as coordinate values with a tolerance range in the two-dimensional space, mounting failure can be detected from a deviation in the horizontal loads.

摘要翻译： 在电子部件安装装置中，通过在电子部件的安装方向上设置有堆叠体的压电元件的负载传感器来检测施加到电子部件的垂直载荷和水平载荷。 因此，可以减小负载传感器的水平方向的尺寸，并且可以在电子部件的安装位置附近检测施加到电子部件的负荷。 此外，通过将二维空间中的X方向上的负载值和水平负载的Y方向之间的位置作为具有二维空间中的公差范围的坐标值进行比较，安装失败可以 从水平载荷的偏差中检测。

公开(公告)号：US06332268B1

公开(公告)日：2001-12-25

申请号：US09254687

申请日：1999-03-16

申请人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

发明人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

IPC分类号： H05K330

CPC分类号： H01L21/67132 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

摘要： An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).

摘要翻译： IC芯片（2）可以在被保持在带状支撑构件（5）的同时被提供到预安装工艺，而不从带状支撑构件（5）取出。

公开(公告)号：US5667130A

公开(公告)日：1997-09-16

申请号：US382527

申请日：1995-02-02

申请人： Makoto Morita ,  Masaru Nagaike ,  Richard Gueler ,  Makoto Imanishi ,  Takahiro Yonezawa

发明人： Makoto Morita ,  Masaru Nagaike ,  Richard Gueler ,  Makoto Imanishi ,  Takahiro Yonezawa

IPC分类号： H01L21/60 ,  B23K20/00 ,  H01L21/607 ,  B23K20/10

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K20/007 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78901 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3025

摘要： An ultrasonic wire bonding apparatus and method is capable of maintaining a sufficient clearance between the horn and bonding surface, and thereby increase the working area without using a long horn. In the ultrasonic wire bonding apparatus, a capillary is located at the front end of a horn for holding a wire that is directly supported at the front end of the horn. The capillary is long enough to maintain a sufficient clearance between the horn and the bonding surface. Alternatively, a capillary, which is located at the front end of a horn for holding a wire, is short and is supported at the front end of the horn through a joint or extension. The total length of the joint and the capillary is enough to maintain a sufficient clearance between the horn and the bonding surface.

摘要翻译： 超声波引线接合装置和方法能够在喇叭和接合面之间保持足够的间隙，从而在不使用长喇叭的情况下增加工作面积。 在超声波引线接合装置中，毛细管位于喇叭的前端，用于保持直接支撑在喇叭前端的线材。 毛细管足够长以保持喇叭和接合表面之间的足够的间隙。 或者，位于用于保持电线的喇叭的前端的毛细管是短的，并且通过接头或延伸部支撑在喇叭的前端。 接头和毛细管的总长度足以在喇叭和接合表面之间保持足够的间隙。