发明授权
- 专利标题： Bump bonder with a discard bonding area
- 专利标题（中）： 具有废弃粘合区域的凸块焊接机
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申请号： US936616申请日： 1997-09-24
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公开(公告)号： US5899375A公开(公告)日： 1999-05-04
- 发明人: Koichi Yoshida , Akihiro Yamamoto , Takahiro Yonezawa , Makoto Imanishi
- 申请人： Koichi Yoshida , Akihiro Yamamoto , Takahiro Yonezawa , Makoto Imanishi
- 申请人地址： JPX
- 专利权人： Matsushita Electric Industrial Co., LTD.
- 当前专利权人： Matsushita Electric Industrial Co., LTD.
- 当前专利权人地址： JPX
- 优先权： JPX8-255220 19960927
- 主分类号： B23K20/00
- IPC分类号： B23K20/00 ; H01L21/60 ; H01L21/66 ; B23K37/00 ; B23K1/06
摘要：
The object is to provide a bump bonder wherein the drop of the tact efficiency of bump formation can be reduced to a low level by discard-bonding of unsatisfactory balls (3) so that satisfactory bumps can be formed. It features arranging a discard bonding chip (19) on bonding stage (17), which holds in their prescribed positions the semiconductor chips (13a), (13b) that are to be subjected to bump formation and performing discard bonding to discard bonding chip (19). Due to this construction, discard bonding can be effected without needing to move the capillary far from the bonding stage (17), which is the working position.
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