发明授权
- 专利标题: Spring-loaded ball contact connector
- 专利标题(中): 弹簧球接触接头
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申请号: US834789申请日: 1997-04-03
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公开(公告)号: US5899753A公开(公告)日: 1999-05-04
- 发明人: Tse E. Wong , Harold M. Cohen , Mohi Sobhani
- 申请人: Tse E. Wong , Harold M. Cohen , Mohi Sobhani
- 申请人地址: MA Lexington
- 专利权人: Raytheon Company
- 当前专利权人: Raytheon Company
- 当前专利权人地址: MA Lexington
- 主分类号: H01R13/24
- IPC分类号: H01R13/24 ; H01R39/64 ; H01R39/00
摘要:
A spring-loaded ball contact device having a housing, a spring disposed in the housing, a moveable plunger disposed in the housing that contacts the spring, a freely moveable ball contact disposed at an end of the plunger, and a lubricant stored within the housing for lubricating the ball contact. A rotary connector using the spring-loaded ball contact devices has first and second printed wiring boards that rotate relative to each other that are electrically interconnected using a plurality of spring-loaded ball contact devices disposed on the first printed wiring board. The spring-loaded ball contact devices are used to transfer electrical signals or power to conductive contacts formed on the second printed wiring board.
公开/授权文献
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