发明授权
US5901901A Semiconductor assembly with solder material layer and method for
soldering the semiconductor assemly
失效
具有焊料材料层的半导体组件和用于焊接半导体的方法
- 专利标题： Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly
- 专利标题（中）： 具有焊料材料层的半导体组件和用于焊接半导体的方法
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申请号： US802134申请日： 1997-02-19
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公开(公告)号： US5901901A公开(公告)日： 1999-05-11
- 发明人: Manfred Schneegans , Holger Huebner
- 申请人： Manfred Schneegans , Holger Huebner
- 申请人地址： DEX Munich
- 专利权人： Siemens Aktiengesellschaft
- 当前专利权人： Siemens Aktiengesellschaft
- 当前专利权人地址： DEX Munich
- 优先权： DEX19606101 19960219
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H01L21/02 ; H01L21/60 ; H01L23/482 ; H05K3/34 ; H01L29/00
摘要：
In a semiconductor assembly with a solder material layer and a method for soldering the semiconductor assembly, a silicon semiconductor body with a diffusion barrier layer is provided with a solder material layer, preferably a tin layer. The semiconductor body is then applied to a metal carrier plate and is directly soldered to the carrier plate by heating to temperatures to above 250.degree. C., i.e. without further additions.
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