发明授权
- 专利标题： Semiconductor module comprising semiconductor packages
- 专利标题（中）： 半导体模块包括半导体封装
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申请号： US73836申请日： 1998-05-06
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公开(公告)号： US5903049A公开(公告)日： 1999-05-11
- 发明人: Ryuichiro Mori
- 申请人： Ryuichiro Mori
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX9-297288 19971029
- 主分类号： H01L25/18
- IPC分类号： H01L25/18 ; H01L23/31 ; H01L25/065 ; H01L25/07 ; H01L25/10 ; H01L25/11 ; H01L23/02
摘要：
Each of two semiconductor elements 1a or 1b is connected to wiring patterns 3a or 3b on an element substrate 2a or 2b via a bump 4a or 4b, respectively. These members are sealed off by sealing resin to form a semiconductor package 6a or 6b, and the same are disposed on a mounting substrate 8 one above the other with an adhesive agent 9 applied thereto. A portion of the wiring pattern 3a not covered by the sealing resin 5, which portion is connected to the semiconductor element 1a, a portion of the wiring pattern 3b connected to the semiconductor element 1b, and an electrode on the mounting substrate 8 are electrically interconnected by connecting wires 7.
公开/授权文献
- USD400936S Manipulable puzzle 公开/授权日：1998-11-10
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